SLLS573E December   2003  – March 2024 SN65MLVD200A , SN65MLVD202A , SN65MLVD204A , SN65MLVD205A

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison Table
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics
    6. 6.6  Electrical Characteristics – Driver
    7. 6.7  Electrical Characteristics – Receiver
    8. 6.8  Electrical Characteristics – BUS Input and Output
    9. 6.9  Switching Characteristics – Driver
    10. 6.10 Switching Characteristics – Receiver
    11. 6.11 Typical Characteristics
  8. 7 Parameter Measurement Information
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Power-On Reset
      2. 8.3.2 ESD Protection
    4. 8.4 Device Functional Modes
      1. 8.4.1 Device Function Tables
      2. 8.4.2 Equivalent Input and Output Schematic Diagrams
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1  Supply Voltage
        2. 9.2.2.2  Supply Bypass Capacitance
        3. 9.2.2.3  Driver Input Voltage
        4. 9.2.2.4  Driver Output Voltage
        5. 9.2.2.5  Termination Resistors
        6. 9.2.2.6  Receiver Input Signal
        7. 9.2.2.7  Receiver Input Threshold (Failsafe)
        8. 9.2.2.8  Receiver Output Signal
        9. 9.2.2.9  Interconnecting Media
        10. 9.2.2.10 PCB Transmission Lines
      3. 9.2.3 Application Curves
  11. 10Power Supply Recommendations
  12. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 Microstrip Versus Stripline Topologies
      2. 11.1.2 Dielectric Type and Board Construction
      3. 11.1.3 Recommended Stack Layout
      4. 11.1.4 Separation Between Traces
      5. 11.1.5 Crosstalk and Ground Bounce Minimization
      6. 11.1.6 Decoupling
    2. 11.2 Layout Example
  13. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Support Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  14. 13Revision History
  15. 14Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • D|14
Thermal pad, mechanical data (Package|Pins)
Orderable Information

9.2 Typical Application

Figure 9-1 shows a multipoint configuration. In a multipoint configuration, many transmitters and many receivers can be interconnected on one transmission line. The key difference compared to multidrop is the presence of two or more drivers. Such a situation creates contention issues that must not be addressed with point-to-point or multidrop systems. Multipoint operation allows for bidirectional, half-duplex communication over one balanced media pair. To support the location of the various drivers throughout the transmission line, double termination of the transmission line is now necessary.

The major challenge that system designers encounter are the impedance discontinuities that device loading and device connections (stubs) introduce on the common bus. Matching the impedance of the loaded bus and using signal drivers with controlled signal edges are the keys to error-free signal transmissions in multipoint topologies.

SN65MLVD200A SN65MLVD202A SN65MLVD204A SN65MLVD205A Multipoint ConfigurationFigure 9-1 Multipoint Configuration