SDLS032H December   1983  – September 2016 SN5407 , SN5417 , SN7407 , SN7417

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Related Links
    3. 12.3 Receiving Notification of Documentation Updates
    4. 12.4 Community Resources
    5. 12.5 Trademarks
    6. 12.6 Electrostatic Discharge Caution
    7. 12.7 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • D|14
  • N|14
  • NS|14
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)
MIN MAX UNIT
VCC Supply voltage 7 V
VI Input voltage(2) 5.5 V
VO Output voltage(2)(3) SN5407, SN7407 30 V
SN5417, SN7417 15
TJ Junction temperature 150 ºC
Tstg Storage temperature –65 150 ºC
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltage values are with respect to GND.
(3) This is the maximum voltage that can safely be applied to any output when it is in the OFF state.

6.2 ESD Ratings

VALUE UNIT
SN7407 AND SN7417
V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000 V
Charged-device model (CDM), per JEDEC specification JESD22-C101(2) ±1000
SN5407 AND SN5417
V(ESD) Electrostatic discharge Human-body model (HBM) ±2000 V
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)(1)
MIN NOM MAX UNIT
VCC Supply voltage SN5407, SN5417 4.5 5 5.5 V
SN7407, SN7417 4.75 5 5.25
VIH High-level input voltage 2 V
VIL Low-level input voltage 0.8 V
VOH High-level output voltage SN5407, SN7407 30 V
SN5417, SN7417 15
IOL Low-level output current SN5407, SN5417 30 mA
SN7407, SN7417 40
TA Operating free-air temperature SN5407, SN5417 –55 125 °C
SN7407, SN7417 0 70
(1) All unused inputs of the device must be held at VCC or GND to ensure proper device operation. See Implications of Slow or Floating CMOS Inputs,.

6.4 Thermal Information

THERMAL METRIC(1) SN7407 SN7417 UNIT
D (SOIC) N (PDIP) NS (SO) D (SOIC) N (PDIP)
14 PINS 14 PINS 14 PINS 14 PINS 14 PINS
RθJA Junction-to-ambient thermal resistance(2) 86.8 52.1 85.9 88.8 52.1 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 47.1 39.4 43.9 50.4 39.4 °C/W
RθJB Junction-to-board thermal resistance 41 32 44.7 43 32 °C/W
ψJT Junction-to-top characterization parameter 15.6 24.2 14.6 16.5 24.2 °C/W
ψJB Junction-to-board characterization parameter 40.8 31.8 44.4 42.8 31.8 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.
(2) The package thermal impedance is calculated in accordance with JESD 51-7.

6.5 Electrical Characteristics

over recommended operating free-air temperature range (unless otherwise noted)(2)(1)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
VIK Input clamp voltage VCC = MIN, II = –12 mA –1.5 V
VOL Low-level output voltage VCC = MIN,
VIL = 0.8 V		 IOL = 16 mA 0.4 V
IOL = 30 mA, SN5407, SN5417 0.7
IOL = 40 mA, SN7407, SN7417 0.7
IOH High-level output current VCC = MIN,
VIH = 2 V		 VOH = 30 V, SN5407, SN7407 0.25 mA
VOH = 15 V, SN5417, SN7417 0.25
II Input current VCC = MAX, VI = 5.5 V 1 mA
IIH High-level input current VCC = MAX, VIH = 2.4 V 40 µA
IIL Low-level input current VCC = MAX, VIL = 0.4 V –1.6 mA
ICCH High-level supply current VCC = MAX 29 41 mA
ICCL Low-level supply current VCC = MAX 21 30 mA
(1) For conditions shown as MIN or MAX, use the appropriate value specified under recommended operating conditions.
(2) All typical values are at VCC = 5 V, TA = 25°C.

6.6 Switching Characteristics

VCC = 5 V, TA = 25°C (see Figure 2)
PARAMETER FROM (INPUT) TO (OUTPUT) TEST CONDITIONS MIN TYP MAX UNIT
tPLH A Y RL = 110 Ω, CL = 15 pF 6 10 ns
tPHL 20 30
tPLH A Y RL = 150 Ω, CL = 50 pF 15 ns
tPHL 26

6.7 Typical Characteristics

SN5407 SN5417 SN7407 SN7417 tplh.png Figure 1. Time Low to High vs VOUT