SCAS786C November   2004  – January 2023 SN74AC04-Q1

PRODMIX  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Switching Characteristics
    8. 6.8 Operating Characteristics
  7. Parameter Measurement Information
    1. 7.1 16
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Balanced CMOS Push-Pull Outputs
      2. 8.3.2 Clamp Diode Structure
    4. 8.4 Device Functional Modes
  9. Application Information Disclaimer
    1. 9.1 Power Supply Recommendations
    2. 9.2 Layout
      1. 9.2.1 Layout Guidelines
        1. 9.2.1.1 Layout Example
  10. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  11. 11Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • PW|14
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Recommended Operating Conditions

MINMAX UNIT
VCC Supply voltage 2 6 V
VIH High-level input voltage VCC = 3 V 2.1 V
VCC = 4.5 V 3.15
VCC = 5.5 V3.85
VILLow-level input voltageVCC = 3 V0.9V
VCC = 4.5 V 1.35
VCC = 5.5 V 1.65
VIInput voltage0VCCV
VOOutput voltage0VCCV
IOHHigh-level output currentVCC = 3 V− 12 mA
VCC = 4.5 V − 24
VCC = 5.5 V − 24
IOLLow-level output currentVCC = 3 V12mA
VCC = 4.5 V 24
VCC = 5.5 V 24
∆t/∆v Input transition rise or fall rate 8 ns/V
TA Operating free-air temperature Q- suffix devices − 40 125 ° C
I- suffix devices − 40 85