Changes from Revision B (January 2008) to Revision C (January 2023)
- Added Applications,
Device Information table, Pin Functions
table, ESD Ratings table, Thermal
Information table, Typical
Characteristics, Feature Description
section, Device Functional Modes,
Application and Implementation section,
Power Supply Recommendations section,
Layout section, Device and Documentation
Support section, and Mechanical, Packaging,
and Orderable Information
sectionGo
- Updated Layout Example imageGo