10 Revision History
Changes from Revision F (January 2023) to Revision G (July 2024)
- Added BQA package to Device Information table, Pin
Configuration and Functions section, and Thermal Information
tableGo
- Added package size to Device Information
tableGo
- Updated RθJA values: D = 86 to 89.9, NS = 76 to 92.4, PW = 113 to
148, all values in °C/WGo
- Updated Layout Example imageGo
Changes from Revision E (July 1995) to Revision F (January 2023)
- Added Applications, Device Information table, Pin
Functions table, ESD Ratings table, Thermal Information
table, Typical Characteristics, Feature Description section,
Device Functional Modes, Application and Implementation section, Power
Supply Recommendations section, Layout section, Device and
Documentation Support section, and Mechanical, Packaging, and
Orderable Information sectionGo