SCASE10 June   2024 SN74AC138-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Switching Characteristics
    7. 5.7 Typical Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Balanced CMOS Push-Pull Outputs
      2. 7.3.2 Standard CMOS Inputs
      3. 7.3.3 Wettable Flanks
      4. 7.3.4 Clamp Diode Structure
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
        1. 8.2.1.1 Power Considerations
        2. 8.2.1.2 Input Considerations
        3. 8.2.1.3 Output Considerations
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Receiving Notification of Documentation Updates
    2. 9.2 Support Resources
    3. 9.3 Trademarks
    4. 9.4 Electrostatic Discharge Caution
    5. 9.5 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • PW|16
  • BQB|16
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Pin Configuration and Functions

SN74AC138-Q1 PW Package,16-Pin TSSOP(Top View)Figure 4-1 PW Package,
16-Pin TSSOP
(Top View)
SN74AC138-Q1 BQB Package,16-Pin WQFN(Transparent Top View)Figure 4-2 BQB Package,
16-Pin WQFN
(Transparent Top View)
Table 4-1 Pin Functions
PIN TYPE(1) DESCRIPTION
NAME NO.
A0 1 I Address select 0
A1 2 I Address select 1
A2 3 I Address select 2
G0 4 I Output strobe 0, active low
G1 5 I Output strobe 1, active low
G2 6 I Output strobe 2
Y7 7 O Output 7
GND 8 G Ground
Y6 9 O Output 6
Y5 10 O Output 5
Y4 11 O Output 4
Y3 12 O Output 3
Y2 13 O Output 2
Y1 14 O Output 1
Y0 15 O Output 0
VCC 16 P Positive supply
Thermal pad(2) — The thermal pad can be connect to GND or left floating. Do not connect to any other signal or supply.
(1) I = Input, O = Output, I/O = Input or Output, G = Ground, P = Power.
(2) BQB package only.