SCASE13 July   2024 SN74AC16

PRODUCTION DATA  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Pin Configuration and Functions
  6. Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Switching Characteristics
    7. 5.7 Typical Characteristics
  7. Parameter Measurement Information
  8. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Open-Drain CMOS Outputs
      2. 7.3.2 CMOS Schmitt-Trigger Inputs
      3. 7.3.3 Clamp Diode Structure
    4. 7.4 Device Functional Modes
  9. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
        1. 8.2.1.1 Power Considerations
        2. 8.2.1.2 Input Considerations
        3. 8.2.1.3 Output Considerations
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. Device and Documentation Support
    1. 9.1 Receiving Notification of Documentation Updates
    2. 9.2 Support Resources
    3. 9.3 Trademarks
    4. 9.4 Electrostatic Discharge Caution
    5. 9.5 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information
    1. 11.1 Tape and Reel Information
    2. 11.2 Mechanical Data

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Pin Configuration and Functions

SN74AC16 SN74AC16 PW
            Package, 14-Pin TSSOP (Top View)Figure 4-1 SN74AC16 PW Package, 14-Pin TSSOP (Top View)
SN74AC16 BQA Package, 14-Pin WQFN (Top
            View)Figure 4-2 BQA Package, 14-Pin WQFN (Top View)
Table 4-1 Pin Functions
PIN TYPE(1) DESCRIPTION
NAME NO.
1A 1 I Channel 1 input
1Y 2 O Channel 1 output
2A 3 I Channel 2 input
2Y 4 O Channel 2 output
3A 5 I Channel 3 input
3Y 6 O Channel 3 output
GND 7 G Ground
4Y 8 O Channel 4 output
4A 9 I Channel 4 input
5Y 10 O Channel 5 output
5A 11 I Channel 5 input
6Y 12 O Channel 6 output
6A 13 I Channel 6 input
VCC 14 P Positive supply
Thermal pad(2) The thermal pad can be connected to GND or left floating. Do not connect to any other signal or supply
Signal Types: I = Input, O = Output, I/O = Input or Output, P = Power, G = Ground
BQA Package only.