SCASE13
July 2024
SN74AC16
PRODUCTION DATA
1
1
Features
2
Applications
3
Description
4
Pin Configuration and Functions
5
Specifications
5.1
Absolute Maximum Ratings
5.2
ESD Ratings
5.3
Recommended Operating Conditions
5.4
Thermal Information
5.5
Electrical Characteristics
5.6
Switching Characteristics
5.7
Typical Characteristics
6
Parameter Measurement Information
7
Detailed Description
7.1
Overview
7.2
Functional Block Diagram
7.3
Feature Description
7.3.1
Open-Drain CMOS Outputs
7.3.2
CMOS Schmitt-Trigger Inputs
7.3.3
Clamp Diode Structure
7.4
Device Functional Modes
8
Application and Implementation
8.1
Application Information
8.2
Typical Application
8.2.1
Design Requirements
8.2.1.1
Power Considerations
8.2.1.2
Input Considerations
8.2.1.3
Output Considerations
8.2.2
Detailed Design Procedure
8.2.3
Application Curves
8.3
Power Supply Recommendations
8.4
Layout
8.4.1
Layout Guidelines
8.4.2
Layout Example
9
Device and Documentation Support
9.1
Receiving Notification of Documentation Updates
9.2
Support Resources
9.3
Trademarks
9.4
Electrostatic Discharge Caution
9.5
Glossary
10
Revision History
11
Mechanical, Packaging, and Orderable Information
11.1
Tape and Reel Information
11.2
Mechanical Data
Package Options
Mechanical Data (Package|Pins)
PW|14
MPDS360A
BQA|14
MPQF538A
Thermal pad, mechanical data (Package|Pins)
BQA|14
QFND686
Orderable Information
scase13_oa
5.2
ESD Ratings
VALUE
UNIT
V
(ESD)
Electrostatic discharge
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001
(1)
±2000
V
Charged-device model (CDM), per ANSI/ESDA/JEDEC JS-002
(2)
±1000
(1)
JEDEC document JEP155 states that 500V HBM allows safe manufacturing with a standard ESD control process.
(2)
JEDEC document JEP157 states that 250V CDM allows safe manufacturing with a standard ESD control process.