SCLS971B August   2023  – March 2024 SN74AC245-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Switching Characteristics
    7. 5.7 Typical Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Balanced CMOS 3-State Outputs
      2. 7.3.2 Standard CMOS Inputs
      3. 7.3.3 Clamp Diode Structure
      4. 7.3.4 Wettable Flanks
    4. 7.4 Device Functional Modes
  9. 8 Application Information Disclaimer
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
        1. 8.2.1.1 Power Considerations
        2. 8.2.1.2 Input Considerations
        3. 8.2.1.3 Output Considerations
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Receiving Notification of Documentation Updates
    2. 9.2 Support Resources
    3. 9.3 Trademarks
    4. 9.4 Electrostatic Discharge Caution
    5. 9.5 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • RKS|20
  • DGS|20
  • PW|20
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Pin Configuration and Functions

GUID-20200922-CA0I-3QXS-GDZ2-RGMJ0XTDV6LF-low.gifFigure 4-1 DGS or PW Package, 20-Pin VSSOP or TSSOP (Top View)
GUID-20220216-SS0I-CMZV-MGKQ-7M6BT2KLPG8M-low.gifFigure 4-2 RKS Package, 20-Pin VQFN (Top View)
Table 4-1 Pin Functions
PINTYPE(1)DESCRIPTION
NAMENO.
DIR 1 I Direction control input (L = B → A, H = A → B)
A1 2 I/O Channel 1 output/input A
A2 3 I/O Channel 2 output/input A
A3 4 I/O Channel 3 output/input A
A4 5 I/O Channel 4 output/input A
A5 6 I/O Channel 5 output/input A
A6 7 I/O Channel 6 output/input A
A7 8 I/O Channel 7 output/input A
A8 9 I/O Channel 8 output/input A
GND 10 — Ground
B8 11 I/O Channel 8 input/output B
B7 12 I/O Channel 7 input/output B
B6 13 I/O Channel 6 input/output B
B5 14 I/O Channel 5 input/output B
B4 15 I/O Channel 4 input/output B
B3 16 I/O Channel 3 input/output B
B2 17 I/O Channel 2 input/output B
B1 18 I/O Channel 1 input/output B
OE 19 I Output enable, active low
VCC 20 — Positive supply
Thermal pad(2)—The thermal pad can be connected to GND or left floating. Do not connect to any other signal or supply
(1) I = input, O = output, I/O = input or output, G = ground, P = power.
(2) RKS package only.