SCASE14
September 2024
SN74AC3G98
ADVANCE INFORMATION
1
1
Features
2
Applications
3
Description
4
Pin Configuration and Functions
5
Specifications
5.1
Absolute Maximum Ratings
5.2
ESD Ratings
5.3
Electrical Characteristics
5.4
Recommended Operating Conditions
5.5
Thermal Information
5.6
Switching Characteristics
6
Parameter Measurement Information
7
Detailed Description
7.1
Overview
7.2
Functional Block Diagram
7.3
Feature Description
7.3.1
Balanced CMOS Push-Pull Outputs
7.3.2
CMOS Schmitt-Trigger Inputs
7.3.3
Clamp Diode Structure
7.4
Device Functional Modes
7.5
Combinatorial Logic Configurations
8
Application and Implementation
8.1
Application Information
8.2
Typical Application
8.2.1
Design Requirements
8.2.1.1
Power Considerations
8.2.1.2
Input Considerations
8.2.1.3
Output Considerations
8.2.2
Detailed Design Procedure
8.2.3
Application Curves
8.2.4
Power Supply Recommendations
8.2.5
Layout
8.2.5.1
Layout Guidelines
8.2.5.2
Layout Example
9
Device and Documentation Support
9.1
Receiving Notification of Documentation Updates
9.2
Support Resources
9.3
Trademarks
9.4
Electrostatic Discharge Caution
9.5
Glossary
10
Revision History
11
Mechanical, Packaging, and Orderable Information
11.1
Tape and Reel Information
11.2
Mechanical Data
Package Options
Mechanical Data (Package|Pins)
BQA|14
MPQF538A
Thermal pad, mechanical data (Package|Pins)
Orderable Information
scase14_oa
8.2.5.2
Layout Example
Figure 8-3
Example Trace Corners for Improved Signal Integrity
Figure 8-4
Example Bypass Capacitor Placement for TSSOP and Similar Packages
Figure 8-6
Example Bypass Capacitor Placement for SOT, SC70 and Similar Packages
Figure 8-5
Example Bypass Capacitor Placement for WQFN and Similar Packages
Figure 8-7
Example Damping Resistor Placement for Improved Signal Integrity