SCASE14 September   2024 SN74AC3G98

ADVANCE INFORMATION  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Electrical Characteristics
    4. 5.4 Recommended Operating Conditions
    5. 5.5 Thermal Information
    6. 5.6 Switching Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Balanced CMOS Push-Pull Outputs
      2. 7.3.2 CMOS Schmitt-Trigger Inputs
      3. 7.3.3 Clamp Diode Structure
    4. 7.4 Device Functional Modes
    5. 7.5 Combinatorial Logic Configurations
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
        1. 8.2.1.1 Power Considerations
        2. 8.2.1.2 Input Considerations
        3. 8.2.1.3 Output Considerations
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
      4. 8.2.4 Power Supply Recommendations
      5. 8.2.5 Layout
        1. 8.2.5.1 Layout Guidelines
        2. 8.2.5.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Receiving Notification of Documentation Updates
    2. 9.2 Support Resources
    3. 9.3 Trademarks
    4. 9.4 Electrostatic Discharge Caution
    5. 9.5 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information
    1. 11.1 Tape and Reel Information
    2. 11.2 Mechanical Data

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Pin Configuration and Functions

SN74AC3G98 SN74AC3G98 BQA Package, 14-Pin WQFN (Top View)Figure 4-1 SN74AC3G98 BQA Package, 14-Pin WQFN (Top View)
Table 4-1 Pin Functions
PIN TYPE(1) DESCRIPTION
NAME NO.
A1 1

I

 Channel 1, input A
B1 2

I

 Channel 1, input B
A2 3

I

 Channel 2, input A
B2 4

I

 Channel 2, input B
A3 5

I

 Channel 3, input A
B3 6

I

 Channel 3, input B
GND 7

G

 Ground
Y3 8

O

 Channel 3, output Y
C3 9

I

 Channel 3, input C
Y2 10

O

 Channel 2, output Y
C2 11

I

 Channel 2, input C
Y1 12

O

 Channel 1, output Y
C1 13 I Channel 1, input C
VCC 14 P Positive supply
Thermal Pad(2) — The thermal pad can be connected to GND or left floating. Do not connect to any other signal or supply
(1) I = input, O = output, I/O = input or output, G = ground, P = power.
(2) BQA package only.