SCASE14
September 2024
SN74AC3G98
ADVANCE INFORMATION
1
1
Features
2
Applications
3
Description
4
Pin Configuration and Functions
5
Specifications
5.1
Absolute Maximum Ratings
5.2
ESD Ratings
5.3
Electrical Characteristics
5.4
Recommended Operating Conditions
5.5
Thermal Information
5.6
Switching Characteristics
6
Parameter Measurement Information
7
Detailed Description
7.1
Overview
7.2
Functional Block Diagram
7.3
Feature Description
7.3.1
Balanced CMOS Push-Pull Outputs
7.3.2
CMOS Schmitt-Trigger Inputs
7.3.3
Clamp Diode Structure
7.4
Device Functional Modes
7.5
Combinatorial Logic Configurations
8
Application and Implementation
8.1
Application Information
8.2
Typical Application
8.2.1
Design Requirements
8.2.1.1
Power Considerations
8.2.1.2
Input Considerations
8.2.1.3
Output Considerations
8.2.2
Detailed Design Procedure
8.2.3
Application Curves
8.2.4
Power Supply Recommendations
8.2.5
Layout
8.2.5.1
Layout Guidelines
8.2.5.2
Layout Example
9
Device and Documentation Support
9.1
Receiving Notification of Documentation Updates
9.2
Support Resources
9.3
Trademarks
9.4
Electrostatic Discharge Caution
9.5
Glossary
10
Revision History
11
Mechanical, Packaging, and Orderable Information
11.1
Tape and Reel Information
11.2
Mechanical Data
Package Options
Mechanical Data (Package|Pins)
BQA|14
MPQF538A
Thermal pad, mechanical data (Package|Pins)
Orderable Information
scase14_oa
5.2
ESD Ratings
VALUE
UNIT
V
(ESD)
Electrostatic discharge
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001
(1)
±2000
V
Charged-device model (CDM), per ANSI/ESDA/JEDEC JS-002
(2)
±1000
(1)
JEDEC document JEP155 states that 500V HBM allows safe manufacturing with a standard ESD control process.
(2)
JEDEC document JEP157 states that 250V CDM allows safe manufacturing with a standard ESD control process.