SCAS959A November   2023  – March 2024 SN74AC573-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Timing Characteristics
    7. 5.7 Switching Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Balanced CMOS 3-State Outputs
      2. 6.3.2 Latching Logic
      3. 6.3.3 Standard CMOS Inputs
      4. 6.3.4 Clamp Diode Structure
    4. 6.4 Device Functional Modes
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
    3. 7.3 Design Requirements
      1. 7.3.1 Power Considerations
      2. 7.3.2 Input Considerations
      3. 7.3.3 Output Considerations
    4. 7.4 Detailed Design Procedure
    5. 7.5 Application Curve
    6. 7.6 Power Supply Recommendations
    7. 7.7 Layout
      1. 7.7.1 Layout Guidelines
      2. 7.7.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Documentation Support
      1. 8.1.1 Related Documentation
    2. 8.2 Receiving Notification of Documentation Updates
    3. 8.3 Support Resources
    4. 8.4 Trademarks
    5. 8.5 Electrostatic Discharge Caution
    6. 8.6 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • RKS|20
  • PW|20
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Pin Configuration and Functions

GUID-20211102-SS0I-PBTD-7DRM-3TMBMK3RTVXK-low.gifFigure 4-1 SN74AC573-Q1 PW Package, 20-Pin TSSOP (Top View)
GUID-20210920-SS0I-PSXT-K0CF-BGKFXQG55BCB-low.gifFigure 4-2 RKS Package, 20-Pin VQFN (Top View)
Table 4-1 Pin Functions
PIN TYPE(1) DESCRIPTION
NAME NO.
OE 1 I Output enable
1D 2 I 1D input
2D 3 I 2D input
3D 4 I 3D input
4D 5 I 4D input
5D 6 I 5D input
6D 7 I 6D input
7D 8 I 7D input
8D 9 I 8D input
GND 10 G Ground
LE 11 I Latch enable input
8Q 12 O 8Q output
7Q 13 O 7Q output
6Q 14 O 6Q output
5Q 15 O 5Q output
4Q 16 O 4Q output
3Q 17 O 3Q output
2Q 18 O 2Q output
1Q 19 O 1Q output
VCC 20 P Positive supply
Thermal pad(3) — The thermal pad can be connected to GND or left floating. Do not connect to any other signal or supply
(1) I = Input, O = Output, I/O = Input or Output, G = Ground, P = Power.
(3) RKS package only.