SCAS962B November   2023  – September 2024 SN74AC8541

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Switching Characteristics
    7. 5.7 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Device Functional Modes
    4. 6.4 Feature Description
      1. 6.4.1 Balanced CMOS 3-State Outputs
      2. 6.4.2 CMOS Schmitt-Trigger Inputs
      3. 6.4.3 Clamp Diode Structure
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
    3. 7.3 Design Requirements
      1. 7.3.1 Power Considerations
      2. 7.3.2 Input Considerations
      3. 7.3.3 Output Considerations
    4. 7.4 Detailed Design Procedure
    5. 7.5 Application Curves
    6. 7.6 Power Supply Recommendations
    7. 7.7 Layout
      1. 7.7.1 Layout Guidelines
      2. 7.7.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Receiving Notification of Documentation Updates
    2. 8.2 Support Resources
    3. 8.3 Trademarks
    4. 8.4 Electrostatic Discharge Caution
    5. 8.5 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • RKS|20
  • DGS|20
  • PW|20
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.4 Thermal Information

THERMAL METRIC(1) SN74AC8541 UNIT
DGS (VSSOP) PW (TSSOP) RKS (VQFN)
20 PINS 20 PINS 20 PINS
RθJA Junction-to-ambient thermal resistance 123.5 126.2 72.9 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 62.1 68.7 77.1 °C/W
RθJB Junction-to-board thermal resistance 78.5 77.3 45.6 °C/W
ΨJT Junction-to-top characterization parameter 7.8 22.3 13.2 °C/W
ΨJB Junction-to-board characterization parameter 78 76.9 45.6 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance N/A N/A 29.4 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.