SCASE27 November   2024 SN74ACT07-Q1

PRODUCTION DATA  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Pin Configuration and Functions
  6. Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Switching Characteristics
    7. 5.7 Typical Characteristics
  7. Parameter Measurement Information
  8. Detailed Description
    1. 7.1 Description
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Open-Drain CMOS Outputs
      2. 7.3.2 TTL-Compatible CMOS Inputs
      3. 7.3.3 Wettable Flanks
      4. 7.3.4 Clamp Diode Structure
    4.     23
    5. 7.4 Device Functional Modes
  9. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
        1. 8.2.1.1 Power Considerations
        2. 8.2.1.2 Input Considerations
        3. 8.2.1.3 Output Considerations
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Pin Configuration and Functions

SN74ACT07-Q1 PW Package, 14-Pin TSSOP
                        (Top View) Figure 4-1 PW Package, 14-Pin TSSOP (Top View)
SN74ACT07-Q1 BQA Package, 14-Pin WQFN
                        (Top View)Figure 4-2 BQA Package, 14-Pin WQFN (Top View)
Table 4-1 Pin Functions
PIN I/O DESCRIPTION
NAME NO.
1A 1 Input Channel 1, Input A
1Y 2 Output Channel 1, Output Y
2A 3 Input Channel 2, Input A
2Y 4 Output Channel 2, Output Y
3A 5 Input Channel 3, Input A
3Y 6 Output Channel 3, Output Y
GND 7 Ground
4Y 8 Output Channel 4, Output Y
4A 9 Input Channel 4, Input A
5Y 10 Output Channel 5, Output Y
5A 11 Input Channel 5, Input A
6Y 12 Output Channel 6, Output Y
6A 13 Input Channel 6, Input A
VCC 14 Positive Supply
Thermal Pad(1) The thermal pad can be connected to GND or left floating. Do not connect to any other signal or supply
BQA package only.