SCASE30
November 2024
SN74ACT16-Q1
PRODUCTION DATA
1
1
Features
2
Applications
3
Description
4
Pin Configuration and Functions
5
Specifications
5.1
Absolute Maximum Ratings
5.2
ESD Ratings
5.3
Recommended Operating Conditions
5.4
Thermal Information
5.5
Electrical Characteristics
5.6
Switching Characteristics
5.7
Typical Characteristics
6
Parameter Measurement Information
7
Detailed Description
7.1
Overview
7.2
Functional Block Diagram
7.3
Feature Description
7.3.1
Open-Drain CMOS Outputs
7.3.2
TTL-Compatible Schmitt-Trigger CMOS Inputs
7.3.3
Clamp Diode Structure
7.4
Device Functional Modes
8
Application and Implementation
8.1
Application Information
8.2
Typical Application
8.2.1
Design Requirements
8.2.1.1
Power Considerations
8.2.1.2
Input Considerations
8.2.1.3
Output Considerations
8.2.2
Detailed Design Procedure
8.2.3
Application Curves
9
Power Supply Recommendations
10
Layout
10.1
Layout Guidelines
10.2
Layout Example
11
Device and Documentation Support
11.1
Documentation Support
11.1.1
Related Documentation
11.2
Receiving Notification of Documentation Updates
11.3
Support Resources
11.4
Trademarks
11.5
Electrostatic Discharge Caution
11.6
Glossary
12
Revision History
13
Mechanical, Packaging, and Orderable Information
Package Options
Mechanical Data (Package|Pins)
PW|14
MPDS360A
BQA|14
MPQF538A
Thermal pad, mechanical data (Package|Pins)
BQA|14
QFND687
Orderable Information
scase30_oa
scase30_pm
10.2
Layout Example
Figure 10-1
Example Trace Corners for Improved Signal Integrity
Figure 10-2
Example Bypass Capacitor Placement for TSSOP and Similar Packages
Figure 10-4
Example Bypass Capacitor Placement for SOT, SC70 and Similar Packages
Figure 10-3
Example Bypass Capacitor Placement for WQFN and Similar Packages
Figure 10-5
Example Damping Resistor Placement for Improved Signal Integrity