SCAS974 March   2024 SN74ACT8541

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Switching Characteristics
    7. 5.7 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Balanced CMOS 3-State Outputs
      2. 6.3.2 TTL-Compatible Schmitt-Trigger CMOS Inputs
      3. 6.3.3 Clamp Diode Structure
    4. 6.4 Device Functional Modes
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
    3. 7.3 Design Requirements
      1. 7.3.1 Power Considerations
      2. 7.3.2 Input Considerations
      3. 7.3.3 Output Considerations
    4. 7.4 Detailed Design Procedure
    5. 7.5 Application Curves
    6. 7.6 Power Supply Recommendations
    7. 7.7 Layout
      1. 7.7.1 Layout Guidelines
      2. 7.7.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Documentation Support
      1. 8.1.1 Related Documentation
    2. 8.2 Receiving Notification of Documentation Updates
    3. 8.3 Support Resources
    4. 8.4 Trademarks
    5. 8.5 Electrostatic Discharge Caution
    6. 8.6 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • RKS|20
  • DGS|20
  • PW|20
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Pin Configuration and Functions

GUID-20211117-SS0I-4VQF-GV22-HQ4B18DGFGR5-low.gifFigure 4-1 PW and DGS Package,
20-Pin TSSOP and VSSOP
(Top View)
GUID-20210920-SS0I-W1XM-ZJ3J-G2H0WVT03ZGJ-low.gifFigure 4-2 RKS Package,
20-Pin VQFN
(Top View)
Table 4-1 Pin Functions
PIN TYPE(1) DESCRIPTION
NAME NO.
OE1 1

I

 Output enable input 1, active low
A1 2

I

 Input for channel 1
A2 3

I

 Input for channel 2
A3 4

I

 Input for channel 3
A4 5

I

 Input for channel 4
A5 6

I

 Input for channel 5
A6 7

I

 Input for channel 6
A7 8

I

 Input for channel 7
A8 9

I

 Input for channel 8
GND 10

G

 Ground
Y8 11

O

 Output for channel 8
Y7 12

O

 Output for channel 7
Y6 13

O

 Output for channel 6
Y5 14 O Output for channel 5
Y4 15 O Output for channel 4
Y3 16 O Output for channel 3
Y2 17 O Output for channel 2
Y1 18 O Output for channel 1
OE2 19 I Output enable input 2, active low
VCC 20

P

 Positive supply
Thermal Pad(3) — The thermal pad can be connect to GND or left floating. Do not connect to any other signal or supply.
(1) I = Input, O = Output, I/O = Input or Output, G = Ground, P = Power.
(3) RKS package only.