SGDS013C february   2002  – june 2023 SN74AHC00-Q1

PRODUCTION DATA  

  1.   1
  2. 1Features
  3. 2Description
  4. 3Revision History
  5. 4Pin Configuration and Functions
  6. 5Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Switching Characteristics, VCC = 3.3 V ± 0.3 V
    7. 5.7 Switching Characteristics, VCC = 5 V ± 0.5 V
    8. 5.8 Noise Characteristics
    9. 5.9 Operating Characteristics
  7. 6Parameter Measurement Information
  8. 7Detailed Description
    1. 7.1 Functional Block Diagram
    2. 7.2 Device Functional Modes
  9. 8Device and Documentation Support
    1. 8.1 Documentation Support
      1. 8.1.1 Related Documentation
    2. 8.2 Receiving Notification of Documentation Updates
    3. 8.3 Support Resources
    4. 8.4 Trademarks
    5. 8.5 Electrostatic Discharge Caution
    6. 8.6 Glossary
  10. 9Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • D|14
  • PW|14
  • BQA|14
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.4 Thermal Information

THERMAL METRIC1 SN74AHC00-Q1 UNIT
D (SOIC) PW (TSSOP) BQA (WQFN)
14 PINS 14 PINS 14 PINS
RθJA Junction-to-ambient thermal resistance 86 147.7 88.3 °C/W