SGDS010E September   1998  – May 2024 SN74AHC08Q-Q1

PRODUCTION DATA  

  1.   1
  2. 1Features
  3. 2Description
  4. 3Pin Configuration and Functions
  5. 4Specifications
    1. 4.1 Absolute Maximum Ratings
    2. 4.2 ESD Ratings
    3. 4.3 Recommended Operating Conditions
    4. 4.4 Thermal Information
    5. 4.5 Electrical Characteristics
    6. 4.6 Switching Characteristics, VCC = 3.3 V ± 0.3 V
    7. 4.7 Switching Characteristics, VCC = 5 V ± 0.5 V
    8. 4.8 Noise Characteristics
    9. 4.9 Operating Characteristics
  6. 5Parameter Measurement Information
  7. 6Detailed Description
    1. 6.1 Functional Block Diagram
    2. 6.2 Device Functional Modes
  8. 7Device and Documentation Support
    1. 7.1 Documentation Support
      1. 7.1.1 Related Documentation
    2. 7.2 Receiving Notification of Documentation Updates
    3. 7.3 Support Resources
    4. 7.4 Trademarks
    5. 7.5 Electrostatic Discharge Caution
    6. 7.6 Glossary
  9. 8Revision History
  10. 9Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • D|14
  • PW|14
  • BQA|14
Thermal pad, mechanical data (Package|Pins)
Orderable Information

3 Pin Configuration and Functions

SN74AHC08Q-Q1 D or PW Package, 14-Pin SOIC or TSSOP (Top View)Figure 3-1 D or PW Package, 14-Pin SOIC or TSSOP (Top View)
SN74AHC08Q-Q1 BQA Package, 14-Pin WQFN (Top View)Figure 3-2 BQA Package, 14-Pin WQFN (Top View)
Table 3-1 Pin Functions
PINTYPEDESCRIPTION
NAMENO.
1A1InputChannel 1, Input A
1B2InputChannel 1, Input B
1Y3OutputChannel 1, Output Y
2A4InputChannel 2, Input A
2B5InputChannel 2, Input B
2Y6OutputChannel 2, Output Y
GND7—Ground
3Y8OutputChannel 3, Output Y
3A9InputChannel 3, Input A
3B10InputChannel 3, Input B
4Y11OutputChannel 4, Output Y
4A12InputChannel 4, Input A
4B13InputChannel 4, Input B
VCC14—Positive Supply
Thermal Information — The thermal pad can be connected to GND or left floating. Do not connect to any other signal or supply.