SCLS525C July   2003  – April 2024 SN74AHC125-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Switching Characteristics, VCC = 3.3 V ± 0.3 V
    7. 5.7 Switching Characteristics, VCC = 5 V ± 0.5 V
    8. 5.8 Noise Characteristics
    9. 5.9 Operating Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Functional Block Diagram
    2. 7.2 Device Functional Modes
  9. 8 Device and Documentation Support
    1. 8.1 Documentation Support
    2. 8.2 Receiving Notification of Documentation Updates
    3. 8.3 Support Resources
    4. 8.4 Trademarks
    5. 8.5 Electrostatic Discharge Caution
    6. 8.6 Glossary
  10. 9 Mechanical, Packaging, and Orderable Information
  11. 10Revision History

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • D|14
  • PW|14
  • BQA|14
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Pin Configuration and Functions

GUID-AD623CE1-E5A0-4BE4-8DA7-7696B36CEC66-low.pngFigure 4-1 D or PW Package, 14-Pin SOIC or TSSOP (Top View)
GUID-20230814-SS0I-9CVJ-B2ZK-CJPWTF858Q7F-low.svgFigure 4-2 BQA Package, 14-Pin WQFN (Top View)
Table 4-1 Pin Functions
PIN TYPE(1) DESCRIPTION
NAME NO.
1 OE 1 I Output enable
1A 2 I Input
1Y 3 O Output
2 OE 4 I Output enable
2A 5 I Input
2Y 6 O Output
3 OE 8 I Output enable
3A 9 I Input
3Y 10 I Output
4 OE 13 I Output enable
4A 12 I Input
4Y 11 O Output
GND 7 — Ground
VCC 14 I Supply voltage
Thermal Pad(2) —

The thermal pad can be connected to GND or left floating. Do not connect to any other signal or supply.
(1) I = input, O = output
(2) For BQA package only.