SCLS345L May   1996  – July 2024 SN54AHC157 , SN74AHC157

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Description
  4. 3 Pin Configuration and Functions
  5. 4 Specifications
    1. 4.1  Absolute Maximum Ratings
    2. 4.2  ESD Ratings
    3. 4.3  Recommended Operating Conditions
    4. 4.4  Thermal Information
    5. 4.5  Electrical Characteristics
    6. 4.6  Switching Characteristics, VCC = 3.3V ± 0.3V
    7. 4.7  Switching Characteristics, VCC = 5V ± 0.5V
    8. 4.8  Noise Characteristics
    9. 4.9  Operating Characteristics
    10. 4.10 Typical Characteristics
  6. 5 Parameter Measurement Information
  7. 6 Detailed Description
    1. 6.1 Functional Block Diagram
    2. 6.2 Device Functional Modes
  8. 7 Application and Implementation
    1. 7.1 Power Supply Recommendations
    2. 7.2 Layout
      1. 7.2.1 Layout Guidelines
      2. 7.2.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Documentation Support (Analog)
      1. 8.1.1 Related Links
    2. 8.2 Receiving Notification of Documentation Updates
    3. 8.3 Support Resources
    4. 8.4 Trademarks
    5. 8.5 Electrostatic Discharge Caution
    6. 8.6 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DB|16
  • PW|16
  • NS|16
  • N|16
  • RGY|16
  • D|16
  • DGV|16
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4.4 Thermal Information

THERMAL METRIC(1) SNx4AHC157 UNIT
D DB DGV N NS PW RGY
16
R θJA Junction-to-ambient thermal resistance 93.8 82 120 67 64 135.9 52.9 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC package thermal metrics application report.