SCAS970 February 2024 SN74AHC164
PRODUCTION DATA
Refer to the PDF data sheet for device specific package drawings
THERMAL METRIC(1) | BQA (WQFN) | PW (TSSOP) | UNIT | |
---|---|---|---|---|
14 PINS | 14 PINS | |||
RθJA | Junction-to-ambient thermal resistance | 93.4 | 138.6 | °C/W |
RθJC(top) | Junction-to-case (top) thermal resistance | 96.4 | 67.8 | °C/W |
RθJB | Junction-to-board thermal resistance | 62.8 | 94.8 | °C/W |
ΨJT | Junction-to-top characterization parameter | 12.5 | 10.6 | °C/W |
ΨJB | Junction-to-board characterization parameter | 62.5 | 93.5 | °C/W |
RθJC(bot) | Junction-to-case (bottom) thermal resistance | 39.7 | N/A | °C/W |