SCLS723B April   2011  – February 2024 SN74AHC1G86-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Switching Characteristics, VCC = 3.3V ±0.3V
    7. 5.7 Switching Characteristics, VCC = 5V ±0.5 V
    8. 5.8 Operating Characteristics
    9. 5.9 Typical Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Balanced CMOS Push-Pull Outputs
      2. 7.3.2 Standard CMOS Inputs
      3. 7.3.3 Clamping Diodes
      4. 7.3.4 Over-voltage Tolerant Inputs
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Community Resources
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

10 Revision History

Changes from Revision A (May 2019) to Revision B (February 2024)

  • Updated the numbering format for tables, figures, and cross-references throughout the documentGo
  • Updated thermal values for DBV package from RθJA = 224.1 to 278, RθJC(top) = 152.8 to 180.5, RθJB = 131.8 to 184.4, ΨJT = 65.7 to 115.4, ΨJB = 131.0 to 183.4, RθJC(bot) = N/A, all values in °C/W Go

Changes from Revision * (April 2011) to Revision A (May 2019)

  • Changed Features section Go
  • Added Applications section Go
  • Changed Description sectionGo
  • Changed Pin Configuration and Functions sectionGo
  • Added TJ spec to Absolute Maximum Ratings tableGo
  • Changed Tstg to -65° (min) and 150°C (max) from -40°C (min) and 125°C (max)Go
  • Added ESD Ratings tableGo
  • Added Thermal Information tableGo
  • Added Typical Characteristics sectionGo
  • Added Application and Implementation section Go
  • Added Power Supply Recommendations section Go