SCLSA03 March   2024 SN74AHC257

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6.   6
  7.   7
  8. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Switching Characteristics
    7. 5.7 Noise Characteristics
    8. 5.8 Typical Characteristics
  9. 6 Parameter Measurement Information
  10. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Balanced CMOS 3-State Outputs
      2. 7.3.2 Standard CMOS Inputs
      3. 7.3.3 Clamp Diode Structure
    4. 7.4 Device Functional Modes
  11. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
    3. 8.3 Design Requirements
      1. 8.3.1 Power Considerations
      2. 8.3.2 Input Considerations
      3. 8.3.3 Output Considerations
    4. 8.4 Detailed Design Procedure
    5. 8.5 Application Curve
    6. 8.6 Power Supply Recommendations
    7. 8.7 Layout
      1. 8.7.1 Layout Guidelines
      2. 8.7.2 Layout Example
  12. 9 Device and Documentation Support
    1. 9.1 Receiving Notification of Documentation Updates
    2. 9.2 Support Resources
    3. 9.3 Trademarks
    4. 9.4 Electrostatic Discharge Caution
    5. 9.5 Glossary
  13. 10Revision History
  14. 11Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • BQB|16
  • PW|16
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Table 5-1 Pin Functions
PIN TYPE(1) DESCRIPTION
NAME NO.
A/B 1 I Data select input for all channels
1A 2 I Channel 1, input A
1B 3 I Channel 1, input B
1Y 4 O Channel 1, output Y
2A 5 I Channel 2, input A
2B 6 I Channel 2, input B
2Y 7 O Channel 2, output Y
GND 8 G Ground
3Y 9 O Channel 3, output Y
3B 10 I Channel 3, input B
3A 11 I Channel 3, input A
4Y 12 O Channel 4, output Y
4B 13 I Channel 4, input B
4A 14 I Channel 4, input A
OE 15 I Output enable input for all channels, active low
VCC 16 P Positive supply
Thermal Pad(2) — The thermal pad can be connect to GND or left floating. Do not connect to any other signal or supply.
(1) Signal Types: I = Input, O = Output, P = Power, G = Ground.
(2) BQB package only.