SGDS019D February   2002  – February 2024 SN74AHC32Q-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Switching Characteristics, VCC = 3.3 V ± 0.3 V
    7. 5.7 Switching Characteristics, VCC = 5 V ± 0.5 V
    8. 5.8 Noise Characteristics
    9. 5.9 Operating Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Standard CMOS Inputs
      2. 7.3.2 Balanced CMOS Push-Pull Outputs
      3. 7.3.3 Clamp Diode Structure
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
        1. 8.2.1.1 Power Considerations
        2. 8.2.1.2 Input Considerations
        3. 8.2.1.3 Output Considerations
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support (Analog)
      1. 9.1.1 Related Links
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • D|14
  • PW|14
  • BQA|14
Thermal pad, mechanical data (Package|Pins)
Orderable Information

3 Description

The SN74AHC32Q-Q1 devices are quadruple 2-input positive-OR gates. These devices perform the Boolean function Y = A × B or Y = A + B in positive logic.

Package Information
PART NUMBER PACKAGE(1) PACKAGE SIZE(2) BODY SIZE(3)
SN74AHC32Q-Q1 BQA (WQFN, 14) 3mm × 2.5mm 3mm × 2.5mm
PW (TSSOP, 14) 5mm × 6.4mm 5mm × 4.4mm
D (SOIC, 14) 8.7mm × 6mm 8.7mm × 3.9mm
(1) For more information, see Section 11.
(2) The package size (length × width) is a nominal value and includes pins, where applicable.
(3) The body size (length × width) is a nominal value and does not include pins.
GUID-AC6C3D9D-F593-4B04-A224-6089D1845E7A-low.gifLogic Diagram (Positive Logic)