SCLS235K October   1995  – July 2024 SN54AHC373 , SN74AHC373

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Electrical Characteristics
    6. 5.6  Timing Requirements, VCC = 3.3 V ± 0.3 V
    7. 5.7  Timing Requirements, VCC = 5 V ± 0.5 V
    8. 5.8  Switching Characteristics, VCC = 3.3 V ± 0.3 V
    9. 5.9  Switching Characteristics, VCC = 5 V ± 0.5 V
    10. 5.10 Noise Characteristics
    11. 5.11 Operating Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Power Supply Recommendations
    2. 8.2 Layout
      1. 8.2.1 Layout Guidelines
        1. 8.2.1.1 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DGV|20
  • DB|20
  • NS|20
  • N|20
  • DW|20
  • PW|20
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.4 Thermal Information

THERMAL METRIC(1) SN74AHC373 UNIT
DW DB DGV N NS PW
20 PINS
RθJA Junction-to-ambient thermal resistance 58 70 92 69 60 116.8 °C/W
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report (SPRA953).