SCLS511A June   2003  – February 2024 SN74AHC4066

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Thermal Information
    4. 5.4  Recommended Operating Conditions
    5. 5.5  Electrical Characteristics
    6. 5.6  Switching Characteristics
    7. 5.7  Switching Characteristics
    8. 5.8  Switching Characteristics
    9. 5.9  Analog Switching Characteristics
    10. 5.10 Operating Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Device Functional Modes
  9. 8 Device and Documentation Support
    1. 8.1 Documentation Support
      1. 8.1.1 Related Documentation
    2. 8.2 Receiving Notification of Documentation Updates
    3. 8.3 Support Resources
    4. 8.4 Trademarks
    5. 8.5 Electrostatic Discharge Caution
    6. 8.6 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • D|14
  • RGY|14
  • DB|14
  • DGV|14
  • PW|14
  • N|14
  • NS|14
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.3 Thermal Information

THERMAL METRIC(1)SN74AHC4066UNIT
D
PW
RGY
14 PINS14 PINS14 PINS
RθJAJunction-to-ambient thermal resistance

127.7

150.6

91.9

°C/W
RθJC(top)Junction-to-case (top) thermal resistance

81.8

78.2

91.8

°C/W
RθJC(bottom)Junction-to-case (bottom) thermal resistance

N/A

N/A

50.0

°C/W
RθJBJunction-to-board thermal resistance

84.2

93.7

66.5

°C/W
ψJTJunction-to-top characterization parameter

39.5

24.6

20.0

°C/W
ψJBJunction-to-board characterization parameter

83.7

93.1

66.3

°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.