SCLS244K October   1995  – July 2024 SN54AHC574 , SN74AHC574

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Electrical Characteristics
    6. 5.6  Timing Requirements, VCC = 3.3 V ± 0.3 V
    7. 5.7  Timing Requirements, VCC = 5 V ± 0.5 V
    8. 5.8  Switching Characteristics, VCC = 3.3 V ± 0.3 V
    9. 5.9  Switching Characteristics, VCC = 5 V ± 0.5 V
    10. 5.10 Noise Characteristics
    11. 5.11 Operating Characteristics
    12. 5.12 Typical Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Links
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DGV|20
  • DB|20
  • NS|20
  • N|20
  • DW|20
  • PW|20
Thermal pad, mechanical data (Package|Pins)
Orderable Information

3 Description

The SNx4AHC574 devices are octal edge-triggered D-type flip-flops that feature 3-state outputs designed specifically for driving highly capacitive or relatively low-impedance loads. These devices are particularly suitable for implementing buffer registers, I/O ports, bidirectional bus drivers, and working registers.

Device Information
PART NUMBER PACKAGE(1) PACKAGE SIZE(2) BODY SIZE(3)
SNx4AHC574 DB (SSOP, 20) 7.2mm × 7.8mm 7.50mm x 5.30mm
DGV (TVSOP, 20) 5.00mm x 6.4mm 5.00mm x 4.40mm
DW (SOIC, 20) 12.80mm × 10.3mm 12.8mm x 7.5mm
N (PDIP, 20) 24.33mm x 9.4mm 25.40mm x 6.35mm
PW (TSSOP, 20) 6.50mm × 6.4mm 6.50mm x 4.40mm
(1) For more information, see Section 11.
(2) The package size (length × width) is a nominal value and includes pins, where applicable.
(3) The body size (length × width) is a nominal value and does not include pins.
SN54AHC574 SN74AHC574 Simplified SchematicSimplified Schematic