SCAS998 March   2024 SN74AHC594-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Timing Characteristics
    7.     13
    8. 5.7 Switching Characteristics
    9. 5.8 Noise Characteristics
    10. 5.9 Typical Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Balanced CMOS Push-Pull Outputs
      2. 7.3.2 Latching Logic
      3. 7.3.3 Standard CMOS Inputs
      4. 7.3.4 Wettable Flanks
      5. 7.3.5 Clamp Diode Structure
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
    3. 8.3 Design Requirements
      1. 8.3.1 Power Considerations
      2. 8.3.2 Input Considerations
      3. 8.3.3 Output Considerations
    4. 8.4 Detailed Design Procedure
    5. 8.5 Application Curves
    6. 8.6 Power Supply Recommendations
    7. 8.7 Layout
      1. 8.7.1 Layout Guidelines
      2. 8.7.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Receiving Notification of Documentation Updates
    2. 9.2 Support Resources
    3. 9.3 Trademarks
    4. 9.4 Electrostatic Discharge Caution
    5. 9.5 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Pin Configuration and Functions

GUID-0BF64138-AA99-4467-86A9-548B304BB95C-low.gifFigure 4-1 PW Package,
16-Pin TSSOP
(Top View)
GUID-20200820-CA0I-LVGW-LJH3-D3KLRXHXFLJQ-low.gifFigure 4-2 WBQB Package,
16-Pin WQFN
(Transparent Top View)
Table 4-1 Pin Functions
PIN TYPE(1) DESCRIPTION
NAME NO.
QB 1 O QB output
QC 2 O QC output
QD 3 O QD output
QE 4 O QE output
QF 5 O QF output
QG 6 O QG output
QH 7 O QH output
GND 8 G Ground
QH' 9 O Serial output, can be used for cascading
SRCLR 10 I Shift register clear, active low
SRCLK 11 I Shift register clock, rising edge triggered
RCLK 12 I Output register clock, rising edge triggered
RCLR 13 I Storage register clear, active low
SER 14 I Serial input
QA 15 O QA output
VCC 16 P Positive supply
Thermal Pad(2) — The thermal pad can be connected to GND or left floating. Do not connect to any other signal or supply.
(1) Signal Types: I = Input, O = Output, I/O = Input or Output, P = Power, G = Ground.
(2) WBQB package only.