SCLS373N May   1996  – July 2024 SN74AHC595

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Electrical Characteristics
    6. 5.6  Timing Requirements: VCC = 3.3 V ± 0.3 V
    7. 5.7  Timing Requirements: VCC = 5 V ± 0.5 V
    8. 5.8  Switching Characteristics: VCC = 3.3 V ± 0.3 V
    9. 5.9  Switching Characteristics: VCC = 5 V ± 0.5 V
    10. 5.10 Operating Characteristics
    11. 5.11 Typical Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • BQB|16
  • DB|16
  • PW|16
  • N|16
  • D|16
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.4 Thermal Information

THERMAL METRIC(1) SN74AHC595 UNIT
BQB (WQFN) D (SOIC) DB (SSOP) N (PDIP) PW (TSSOP)
16 PINS 16 PINS 16 PINS 16 PINS 16 PINS
RθJA Junction-to-ambient thermal resistance 91.8 93.8 97.8 47.8 135.9 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 87.7 54.7 48.1 35.1 70.3 °C/W
RθJB Junction-to-board thermal resistance 61.6 50.9 48.5 27.8 81.3 °C/W
ψJT Junction-to-top characterization parameter 11.9 20.8 10.0 20.1 22.5 °C/W
ψJB Junction-to-board characterization parameter 61.4 50.7 47.9 27.7 80.8 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 39.4 — — — — °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.