SGDS007D
May 1998 – February 2024
SN74AHCT00Q-Q1
PRODUCTION DATA
1
1
Features
2
Applications
3
Description
4
Pin Configuration and Functions
5
Specifications
5.1
Absolute Maximum Ratings
5.2
Recommended Operating Conditions
5.3
Thermal Information
5.4
Electrical Characteristics
5.5
Switching Characteristics
5.6
Noise Characteristics
5.7
Operating Characteristics
6
Parameter Measurement Information
7
Detailed Description
7.1
Overview
7.2
Functional Block Diagram
7.3
Feature Description
7.3.1
Balanced CMOS Push-Pull Outputs
7.3.2
TTL-Compatible CMOS Inputs
7.3.3
Clamp Diode Structure
7.3.4
Wettable Flanks
8
Application and Implementation
8.1
Application Information
8.2
Typical Application
8.2.1
Design Requirements
8.2.1.1
Power Considerations
8.2.1.2
Input Considerations
8.2.1.3
Output Considerations
8.2.2
Detailed Design Procedure
8.2.3
Application Curves
8.3
Power Supply Recommendations
8.4
Layout
8.4.1
Layout Guidelines
8.4.2
Layout Example
9
Device and Documentation Support
9.1
Documentation Support
9.1.1
Related Documentation
9.2
Receiving Notification of Documentation Updates
9.3
Support Resources
9.4
Trademarks
9.5
Electrostatic Discharge Caution
9.6
Glossary
10
Revision History
11
Mechanical, Packaging, and Orderable Information
Package Options
Mechanical Data (Package|Pins)
PW|14
MPDS360
BQA|14
MPQF538A
D|14
MPDS177G
Thermal pad, mechanical data (Package|Pins)
BQA|14
QFND687
Orderable Information
sgds007d_oa
sgds007d_pm
8.2.1
Design Requirements