SCLS237P October   1995  – October 2023 SN54AHCT08 , SN74AHCT08

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Revision History
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics, VCC = 5 V ± 0.5 V
    7. 6.7 Noise Characteristics
    8. 6.8 Operating Characteristics
    9. 6.9 Typical Characteristics
  8. 7 Parameter Measurement Information
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
    4. 8.4 Device Functional Modes
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Receiving Notification of Documentation Updates
    2. 10.2 Support Resources
    3. 10.3 Trademarks
    4. 10.4 Electrostatic Discharge Caution
    5. 10.5 Glossary
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • D|14
  • RGY|14
  • DB|14
  • DGV|14
  • PW|14
  • BQA|14
  • N|14
  • NS|14
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.4 Thermal Information

THERMAL METRIC(1) SNx4AHCT08 UNIT
D (SOIC) DB (SSOP) DGV (TVSOP) N (PDIP) BQA (WQFN)
14 PINS 14 PINS 14 PINS 14 PINS 14 PINS
RθJA Junction-to-ambient thermal resistance 124.5 109.5 133.3 59.7 88.3 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 78.8 62.1 55.6 47.3 90.9 °C/W
RθJB Junction-to-board thermal resistance 81 56.9 66.3 39.5 56.8 °C/W
ψJT Junction-to-top characterization parameter 37 22.6 7.8 32.4 9.9 °C/W
ψJB Junction-to-board characterization parameter 80.6 56.3 56.6 39.4 56.7 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance N/A N/A N/A N/A N/A °C/W
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, (SPRA953).