SCLS506D June   2003  – February 2024 SN74AHCT126-Q1

PRODUCTION DATA  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Pin Configuration and Functions
  6. Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Switching Characteristics
    7. 5.7 Noise Characteristics
    8. 5.8 Operating Characteristics
    9. 5.9 Typical Characteristics
  7. Parameter Measurement Information
  8. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Balanced CMOS Push-Pull Outputs
      2. 7.3.2 TTL-Compatible CMOS Inputs
      3. 7.3.3 Clamp Diode Structure
      4. 7.3.4 Wettable Flanks
    4. 7.4 Device Functional Modes
  9. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
        1. 8.2.1.1 Power Considerations
        2. 8.2.1.2 Input Considerations
        3. 8.2.1.3 Output Considerations
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. Device and Documentation Support
    1. 9.1 Documentation Support (Analog)
      1. 9.1.1 Related Links
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Pin Configuration and Functions

GUID-20230518-SS0I-CZ6L-KKM0-SFMLZ9LL2HW2-low.svgFigure 4-1 BQA Package, 14-Pin WQFN (Top View)
GUID-EAD7657F-5911-497F-807F-FE8AD41D0208-low.gifFigure 4-2 D or PW Package, 14-Pin SOIC or TSSOP (Top View)
Table 4-1 Pin Functions
PIN TYPE(1) DESCRIPTION
NAME NO.
1A 2 I 1A Input
1Y 3 O 1Y Output
1OE 1 I 2A Input
2A 5 O 2Y Output
2Y 6 I 3A Input
2OE 4 O 3Y Output
3A 9 I 4A Input
3Y 8 O 4Y Output
3OE 10 I 5A Input
4A 12 I 5Y Output
4Y 11 I 6A Input
4OE 13 O 6Y Output
GND 7 Ground Pin
VCC 14 Power Pin
Thermal Pad(2) The thermal pad can be connected to GND or left floating. Do not connect to any other signal or supply.
Signal Types: I = Input, O = Output, I/O = Input or Output.
BQA package only