SGDS022B February   2002  – March 2024 SN74AHCT138Q-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Description
  4. 3 Pin Configuration and Functions
  5. 4 Specifications
    1. 4.1 Absolute Maximum Ratings
    2. 4.2 ESD Ratings
    3. 4.3 Recommended Operating Conditions
    4. 4.4 Thermal Information
    5. 4.5 Electrical Characteristics
    6. 4.6 Switching Characteristics
    7. 4.7 Operating Characteristics
  6. 5 Parameter Measurement Information
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Device Functional Modes
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Power Supply Recommendations
    3. 7.3 Layout
      1. 7.3.1 Layout Guidelines
      2. 7.3.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Documentation Support
      1. 8.1.1 Related Documentation
    2. 8.2 Related Links
    3. 8.3 Receiving Notification of Documentation Updates
    4. 8.4 Support Resources
    5. 8.5 Trademarks
    6. 8.6 Electrostatic Discharge Caution
    7. 8.7 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • PW|16
  • BQB|16
  • D|16
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4.5 Electrical Characteristics

over recommended operating free-air temperature range (unless otherwise noted)
PARAMETER TEST CONDITIONS VCC TA = 25°C MIN MAX UNIT
MIN TYP MAX
VOH IOH = −50µA 4.5V 4.4 4.5 4.4 V
IOH = −8mA 3.94 3.8
VOL IOL = 50µA 4.5V 0.1 0.1 V
IOL = 8mA 0.36 0.5
II VI = 5.5V or GND 0 V to 5.5 V ±0.1 ± 1 µA
ICC VI = VCC or GND, IO = 0 5.5V 4 40 µA
∆ICC1 One input at 3.4 V, Other inputs at VCC or GND 5.5V 1.35 1.5 mA
Ci VI = VCC or GND 5V 2 10 pF
  1. This is the increase in supply current for each input at one of the specified TTL voltage levels rather than 0V or VCC.