SCAS978 March   2024 SN74AHCT139-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Switching Characteristics
    7. 5.7 Noise Characteristics
    8. 5.8 Typical Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Balanced CMOS Push-Pull Outputs
      2. 7.3.2 TTL-Compatible CMOS Inputs
      3. 7.3.3 Wettable Flanks
      4. 7.3.4 Clamp Diode Structure
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
        1. 8.2.1.1 Power Considerations
        2. 8.2.1.2 Input Considerations
        3. 8.2.1.3 Output Considerations
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • BQB|16
  • PW|16
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Pin Configuration and Functions

GUID-20200706-SS0I-KDPM-NJ5K-S75GZ6VC18CX-low.gifFigure 4-1 PW Package,
16-Pin TSSOP
(Top View)
GUID-20240221-SS0I-VLR6-SNNR-W9RNCGD7QMLM-low.svgFigure 4-2 BQB Package,
16-Pin WQFN
(Top View)
Table 4-1 Pin Functions
PIN TYPE(1) DESCRIPTION
NAME NO.
1G 1 I Channel 1 strobe input, active low
1A0 2 I Channel 1 select input 0
1A1 3 I Channel 1 select input 1
1Y0 4 O Channel 1 output 0
1Y1 5 O Channel 1 output 1
1Y2 6 O Channel 1 output 2
1Y3 7 O Channel 1 output 3
GND 8 G Ground
2Y3 9 O Channel 2 output 3
2Y2 10 O Channel 2 output 2
2Y1 11 O Channel 2 output 1
2Y0 12 O Channel 2 output 0
2A1 13 I Channel 2 input 1
2A0 14 I Channel 2 input 0
2G 15 I Channel 2 strobe input, active low
VCC 16 P Positive supply
Thermal pad(2) — The thermal pad can be connected to GND or left floating. Do not connect to any other signal or supply.
(1) Signal Types: I = Input, O = Output, I/O = Input or Output, P = Power, G = Ground.
(2) WBQB package only.