SGDS023D February   2002  – October 2023 SN74AHCT14Q-Q1

PRODMIX  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Revision History
  6. Pin Configuration and Functions
  7. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Noise Characteristics
    8. 6.8 Operating Characteristics
  8. Parameter Measurement Information
  9. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Device Functional Modes
  10. Application and Implementation
    1. 9.1 Typical Application
    2. 9.2 Power Supply Recommendations
    3. 9.3 Layout
      1. 9.3.1 Layout Guidelines
      2. 9.3.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Receiving Notification of Documentation Updates
    2. 10.2 Support Resources
    3. 10.3 Trademarks
    4. 10.4 Electrostatic Discharge Caution
    5. 10.5 Glossary
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • D|14
  • PW|14
  • BQA|14
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Pin Configuration and Functions

GUID-95307650-B5DD-4B64-A2D3-464F553D5CA0-low.pngFigure 5-1 D or PW Package, 14-Pin SOIC or TSSOP (Top View)
GUID-20230613-SS0I-KXD4-ZZRM-V6M6DGHRWVHC-low.svgFigure 5-2 BQA Package, 14-Pin WQFN (Top View)
PIN TYPE1 DESCRIPTION
NAME NO.
1A 1 I Input 1A
1Y 2 O Output 1Y
2A 3 I Input 2A
2Y 4 O Output 2Y
3A 5 I Input 3A
3Y 6 O Output 3Y
4Y 8 O Output 4Y
4A 9 I Input 4A
5Y 10 O Output 5Y
5A 11 I Input 5A
6Y 12 O Output 6Y
6A 13 I Input 6A
GND 7 Ground Pin
NC No Connection
VCC 14 Power Pin
Thermal Pad1 The thermal pad can be connected to GND or left floating. Do not connect to any other signal or supply.
Signal Types: I = Input, O = Output, I/O = Input or Output.
For BQA package only.