SCLS336I January   2000  – August 2014 SN74AHCT16373

UNLESS OTHERWISE NOTED, this document contains PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Simplified Schematic
  5. 5 Revision History
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  Handling Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Electrical Characteristics
    6. 7.6  Timing Requirements
    7. 7.7  Switching Characteristics
    8. 7.8  Noise Characteristics
    9. 7.9  Operating Characteristics
    10. 7.10 Typical Characteristics
  8. 8 Parameter Measurement Information
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagrams
    3. 9.3 Feature Description
    4. 9.4 Device Functional Modes
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
      3. 10.2.3 Application Curves
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Related Links
    2. 13.2 Trademarks
    3. 13.3 Electrostatic Discharge Caution
    4. 13.4 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DGG|48
  • DL|48
  • DGV|48
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7 Specifications

7.1 Absolute Maximum Ratings(1)

over operating free-air temperature range (unless otherwise noted)
MIN MAX UNIT
VCC Supply voltage range –0.5 7 V
VI Input voltage range(2) –0.5 7 V
VO Output voltage range(2) –0.5 VCC + 0.5 V
IIK Input clamp current VI < 0 –20 mA
IOK Output clamp current VO < 0 or VO > VCC ±20 mA
IO Continuous output current VO = 0 to VCC ±25 mA
Continuous current through VCC or GND ±75 mA
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) The input and output voltage ratings may be exceeded if the input and output current ratings are observed.

7.2 Handling Ratings

MIN MAX UNIT
Tstg Storage temperature range –65 150 °C
V(ESD) Electrostatic discharge Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins(1) 0 2000 V
Charged device model (CDM), per JEDEC specification JESD22-C101, all pins(2) 0 1000
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

7.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)(1)
SN54AHCT16373(2) SN74AHCT16373 UNIT
MIN MAX MIN MAX
VCC Supply voltage 4.5 5.5 4.5 5.5 V
VIH High-level input voltage 2 2 V
VIL Low-level input voltage 0.8 0.8 V
VI Input voltage 0 5.5 0 5.5 V
VO Output voltage 0 VCC 0 VCC V
IOH High-level output current –8 –8 mA
IOL Low-level output current 8 8 mA
∆t/∆v Input transition rise or fall rate 20 20 ns/V
TA Operating free-air temperature –55 125 –40 125 °C
(1) All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs (SCBA004).
(2) Product Preview

7.4 Thermal Information

THERMAL METRIC(1) SN74AHCT16373 UNIT
DGG DGV DL
48 PINS
RθJA Junction-to-ambient thermal resistance 69.9 80.9 61.4 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 24.2 32.8 31.4
RθJB Junction-to-board thermal resistance 26.9 44.0 33.2
ψJT Junction-to-top characterization parameter 1.9 3.3 9.0
ψJB Junction-to-board characterization parameter 36.6 43.4 32.9
RθJC(bot) Junction-to-case (bottom) thermal resistance n/a n/a n/a
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report (SPRA953).

7.5 Electrical Characteristics

over recommended operating free-air temperature range (unless otherwise noted)
PARAMETER TEST CONDITIONS VCC TA = 25°C SN54AHCT16373(1) –40°C to 85°C
SN74AHCT16373		 –40°C to 125°C
SN74AHCT16373		 UNIT
MIN TYP MAX MIN MAX MIN MAX MIN MAX
VOH IOH = –50 µA 4.5 V 4.4 4.5 4.4 4.4 4.4 V
IOH = –8 mA 3.94 3.8 3.8 3.8
VOL IOL = 50 µA 4.5 V 0.1 0.1 0.1 0.1 V
IOL = 8 mA 0.36 0.44 0.44 0.44
II VI = VCC or GND 0 V to
5.5 V		 ±0.1 ±1(2) ±1 ±1 µA
IOZ VO = VCC or GND 5.5 V ±0.25 ±2.5 ±2.5 ±2.5 µA
ICC VI = VCC or GND, IO = 0 5.5 V 4 40 40 40 µA
ΔICC(3) One input at 3.4 V,
Other inputs at VCC or GND		 5.5 V 1.35 1.5 1.5 1.5 mA
Ci VI = VCC or GND 5 V 2.5 10 10 pF
Co VO = VCC or GND 5 V 4.5 pF
(1) Product Preview
(2) On products compliant to MIL-PRF-38535, this parameter is not production tested at VCC = 0 V.
(3) This is the increase in supply current for each input at one of the specified TTL voltage levels rather than 0 V or VCC.

7.6 Timing Requirements

over recommended operating free-air temperature range, VCC = 5 V ± 0.5 V (unless otherwise noted) (see Figure 2)
TA = 25°C SN54AHCT16373(1) SN74AHCT16373 TA = –40°C to 125°C
SN74AHCT16373		 UNIT
MIN MAX MIN MAX MIN MAX MIN MAX
tw Pulse duration, LE high 6.5 6.5 6.5 6.5 ns
tsu Setup time, data before LE↓ 1.5 1.5 1.5 1.5 ns
th Hold time, data after LE↓ 3.5 3.5 3.5 3.5 ns
(1) Product Preview

7.7 Switching Characteristics

over recommended operating free-air temperature range, VCC = 5 V ± 0.5 V (unless otherwise noted) (see Figure 2)
PARAMETER FROM
(OUTPUT)		 TO
(INPUT)		 LOAD
CAPACITANCE		 TA = 25°C SN54AHCT16373(1) SN74AHCT16373 SN74AHCT16373
TA = –40°C to 125°C		 UNIT
MIN TYP MAX MIN MAX MIN MAX MIN MAX
tPLH D Q CL = 15 pF 5.1(2) 8.5(2) 1(2) 9.5(2) 1 9.5 1 10.5 ns
tPHL 5.1(2) 8.5(2) 1(2) 9.5(2) 1 9.5 1 10.5
tPLH LE Q CL = 15 pF 5(2) 8.5(2) 1(2) 9.5(2) 1 9.5 1 10.5 ns
tPHL 5(2) 8.5(2) 1(2) 9.5(2) 1 9.5 1 10.5
tPZH OE Q CL = 15 pF 5(2) 9.5(2) 1(2) 10.5(2) 1 10.5 1 11.1 ns
tPZL 5(2) 9.5(2) 1(2) 10.5(2) 1 10.5 1 11.1
tPHZ OE Q CL = 15 pF 6(2) 10.2(2) 1(2) 11(2) 1 11 1 11.6 ns
tPLZ 6.8(2) 10.2(2) 1(2) 11(2) 1 11 1 11.6
tPLH D Q CL = 50 pF 5.9 9.5 1 10.5 1 10.5 1 11.5 ns
tPHL 5.9 9.5 1 10.5 1 10.5 1 11.5
tPLH LE Q CL = 50 pF 6.4 9.5 1 10.5 1 10.5 1 11.5 ns
tPHL 5.9 9.5 1 10.5 1 10.5 1 11.5
tPZH OE Q CL = 50 pF 6 10.5 1 11.5 1 11.5 1 12.1 ns
tPZL 6 10.5 1 11.5 1 11.5 1 12.1
tPHZ OE Q CL = 50 pF 6.8 11.2 1 12 1 12 1 12.6 ns
tPLZ 7.8 11.2 1 12 1 12 1 12.6
tsk(o) CL = 50 pF 1(3) 1 1 ns
(1) Product Preview
(2) On products compliant to MIL-PRF-38535, this parameter is not production tested.
(3) On products compliant to MIL-PRF-38535, this parameter does not apply.

7.8 Noise Characteristics

VCC = 5 V, CL = 50 pF, TA = 25°C(1)
PARAMETER SN74AHCT16373 UNIT
MIN TYP MAX
VOL(P) Quiet output, maximum dynamic VOL 0.32 0.8 V
VOL(V) Quiet output, minimum dynamic VOL –0.1 –0.8 V
VOH(V) Quiet output, minimum dynamic VOH 4.7 V
VIH(D) High-level dynamic input voltage 2 V
VIL(D) Low-level dynamic input voltage 0.8 V
(1) Characteristics are for surface-mount packages only.

7.9 Operating Characteristics

VCC = 5 V, TA = 25°C
PARAMETER TEST CONDITIONS TYP UNIT
Cpd Power dissipation capacitance No load, f = 1 MHz 22 pF

7.10 Typical Characteristics

D001_SCLS336.gifFigure 1. TPD vs Temperature