SCLS988 November   2023 SN74AHCT165-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Thermal Information
    6. 5.6  Electrical Characteristics
    7. 5.7  Noise Characteristics
    8. 5.8  Timing Characteristics
    9. 5.9  Switching Characteristics
    10. 5.10 Typical Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Balanced CMOS Push-Pull Outputs
      2. 7.3.2 Latching Logic
      3. 7.3.3 TTL-Compatible CMOS Inputs
      4. 7.3.4 Wettable Flanks
      5. 7.3.5 Clamp Diode Structure
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
        1. 8.2.1.1 Power Considerations
        2. 8.2.1.2 Input Considerations
        3. 8.2.1.3 Output Considerations
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • BQB|16
  • PW|16
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Pin Configuration and Functions

GUID-20200731-CA0I-J4NH-F121-TPDWHDVR3W4S-low.gifFigure 4-1 PW Package,
16-Pin TSSOP
(Top View)
GUID-20200827-CA0I-XQTD-RJ5P-KXKTNRGPF8T8-low.gifFigure 4-2 BQB Package,
16-Pin WQFN
(Transparent Top View)
Table 4-1 Pin Functions
PINTYPE(1)DESCRIPTION
NAMENO.
SH/LD1IShift or load mode select
CLK2IShift register clock
E3IE register data
F4IF register data
G5IG register data
H6IH register data
QH7OInverted shift register output
GND 8 G Ground
QH9OShift register output
SER 10 I Shift register clear, active low
A 11 I A register data
B12IB register data
C 13 I C register data
D14ID register data
CLK INH 15 I Clock inhibit
VCC16PPositive supply
Thermal pad(2) — The thermal pad can be connected to GND or left floating. Do not connect to any other signal or supply.
(1) I = input, O = output, P = power, G = ground
(2) For BQB package only