SCLS316P March   1996  – February 2024 SN74AHCT1G00

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Switching Characteristics
    7. 5.7 Operating Characteristics
    8. 5.8 Typical Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
    3. 8.3 Detailed Design Procedure
    4. 8.4 Application Curves
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support (Analog)
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DBV|5
  • DCK|5
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.4 Thermal Information

THERMAL METRIC(1)SN74AHCT1G00UNIT
DBV (SOT-23)DCK (SC-70)
5 PINS5 PINS
RθJAJunction-to-ambient thermal resistance278289.2°C/W
RθJC(top)Junction-to-case (top) thermal resistance180.5205.8
RθJBJunction-to-board thermal resistance184.4176.2
ψJTJunction-to-top characterization parameter115.4117.6
ψJBJunction-to-board characterization parameter183.4175.1
RθJC(bot) Junction-to-case (bottom) thermal resistance N/A N/A
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report (SPRA953).