SCLS721B
December 2010 – January 2024
PRODUCTION DATA
1
1
Features
2
Applications
3
Description
4
Pin Configuration and Functions
5
Specifications
5.1
Absolute Maximum Ratings
5.2
Recommended Operating Conditions
5.3
Thermal Information
5.4
Electrical Characteristics
5.5
Switching Characteristics
5.6
Operating Characteristics
6
Parameter Measurement Information
7
Detailed Description
7.1
Overview
7.2
Functional Block Diagram
7.3
Feature Description
7.3.1
TTL-Compatible CMOS Inputs
7.3.2
Balanced CMOS Push-Pull Outputs
7.3.3
Clamp Diode Structure
7.4
Device Functional Modes
8
Application and Implementation
8.1
Application Information
8.2
Typical Application
8.2.1
Design Requirements
8.2.1.1
Power Considerations
8.2.1.2
Input Considerations
8.2.1.3
Output Considerations
8.2.2
Detailed Design Procedure
8.2.3
Application Curves
8.3
Power Supply Recommendations
8.4
Layout
8.4.1
Layout Guidelines
8.4.1.1
Layout Example
9
Device and Documentation Support
9.1
Documentation Support (Analog)
9.1.1
Related Documentation
9.2
Receiving Notification of Documentation Updates
9.3
Support Resources
9.4
Trademarks
9.5
Electrostatic Discharge Caution
9.6
Glossary
10
Revision History
11
Mechanical, Packaging, and Orderable Information
Package Options
Mechanical Data (Package|Pins)
DCK|5
MPDS025I
DBV|5
MPDS018S
Thermal pad, mechanical data (Package|Pins)
Orderable Information
scls721b_oa
scls721b_pm
9.6
Glossary
TI Glossary
This glossary lists and explains terms, acronyms, and definitions.