SGDS024A february   2002  – may 2023 SN74AHCT244Q

PRODMIX  

  1.   1
  2. 1Features
  3. 2Description
  4. 3Revision History
  5. 4Pin Configuration and Functions
  6. 5Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 Recommended Operating Conditions
    3. 5.3 Thermal Information
    4. 5.4 Electrical Characteristics
    5. 5.5 Switching Characteristics
    6. 5.6 Noise Characteristics
    7. 5.7 Operating Characteristics
  7. 6Parameter Measurement Information
  8. 7Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Device Functional Modes

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DW|20
  • PW|20
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.3 Thermal Information

THERMAL METRIC(1) SN74AHCT244Q UNIT
DW (SOIC) PW (TSSOP)
20 PINS 20 PINS
RθJA Junction-to-ambient thermal resistance 58 83 °C/W
(1) For more information about traditional and new thermal metrics, see Semiconductor and IC Package Thermal Metrics.