SCLS375G June   1997  – August 2024 SN74AHCT273

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  Handling Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Electrical Characteristics
    6. 5.6  Timing Requirements
    7. 5.7  Switching Characteristics
    8. 5.8  Noise Characteristics
    9. 5.9  Operating Characteristics
    10. 5.10 Typical Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagrams
    3. 7.3 Feature Description
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Links
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DB|20
  • NS|20
  • N|20
  • DW|20
  • PW|20
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.4 Thermal Information

THERMAL METRIC(1)SN74AHCT273UNIT
DB (SSOP)DW (SOIC)DGV (TVSOP)N (PDIP)NS (SOP)PW (TSSOP)
20 PINS
RθJAJunction-to-ambient thermal resistance87.281.1118.153.977.6116.8°C/W
RθJC(top)Junction-to-case (top) thermal resistance49.148.933.438.842.758.5
RθJBJunction-to-board thermal resistance51.853.859.634.745.778.7
ψJTJunction-to-top characterization parameter11.619.51.126.910.212.6
ψJBJunction-to-board characterization parameter51.253.158.934.745.277.9
RθJC(bot)Junction-to-case (bottom) thermal resistanceN/AN/AN/AN/AN/AN/A
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, (SPRA953).