SCLS528D July   2003  – February 2024 SN74AHCT32-Q1

PRODMIX  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Switching Characteristics
    7. 5.7 Noise Characteristics
    8. 5.8 Operating Characteristics
    9. 5.9 Typical Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
        1. 8.2.1.1 Power Considerations
        2. 8.2.1.2 Input Considerations
        3. 8.2.1.3 Output Considerations
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
        1. 8.4.1.1 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Receiving Notification of Documentation Updates
    2. 9.2 Support Resources
    3. 9.3 Trademarks
    4. 9.4 Electrostatic Discharge Caution
    5. 9.5 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • D|14
  • PW|14
  • BQA|14
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Pin Configuration and Functions

GUID-0E1DDF94-B887-4A44-9368-08810D0AD457-low.svgFigure 4-1 D or PW Package, 14-Pin SOIC or TSSOP (Top View)
GUID-20201111-CA0I-GHK7-S2JQ-JM1WBD1ZKZML-low.svgFigure 4-2 BQA (Preview) Package, 14-Pin WQFN (Top View)
Table 4-1 Pin Functions
PIN TYPE(1) DESCRIPTION
NAME NO
1A 1 I 1A Input
1B 2 I 1B Input
1Y 3 O 1Y Output
2A 4 I 2A Input
2B 5 I 2B Input
2Y 6 O 2Y Output
GND 7 — Ground Pin
3Y 8 O 3Y Output
3A 9 I 3A Input
3B 10 I 3B Input
4Y 11 O 4Y Output
4A 12 I 4A Input
4B 13 I 4B Input
VCC 14 I Power Pin
Thermal Pad(2) — The thermal pad can be connected to GND or left floating. Do not connect to any other signal or supply.
(1) I = input, O = output
(2) BQA Package Only