SCAS984 March   2024 SN74AHCT595-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Timing Characteristics
    7. 5.7 Switching Characteristics
    8. 5.8 Noise Characteristics
    9. 5.9 Typical Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Balanced CMOS 3-State Outputs
      2. 7.3.2 Latching Logic
      3. 7.3.3 TTL-Compatible CMOS Inputs
      4. 7.3.4 Wettable Flanks
      5. 7.3.5 Clamp Diode Structure
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • BQB|16
  • PW|16
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Pin Configuration and Functions

GUID-20240305-SS0I-KXPC-WS6M-QVPKT5LGXNC1-low.jpgFigure 4-1
SN74AHCT595-Q1 PW Package (Top View)
GUID-20200810-CA0I-Q9NM-WJZN-2VVL5S1MZF0C-low.gifFigure 4-2 SN74AHCT595-Q1 BQB Package, 16-Pin WQFN (Top View)
Table 4-1 Pin Functions
PIN TYPE(1) DESCRIPTION
NAME NO.
QB 1 O QB Output
QC 2 O QC Output
QD 3 O QD Output
QE 4 O QE Output
QF 5 O QF Output
QG 6 O QG Output
QH 7 O QH Output
GND 8 — Ground Pin
QH' 9 O QH' Output
SRCLR 10 I SRCLR Input
SRCLK 11 I SRCLK Input
RCLK 12 I RCLK Input
OE 13 I Output Enable
SER 14 I SER Input
QA 15 O QA Output
VCC 16 — Power Pin
Thermal Pad(2) — The thermal pad can be connected to GND or left floating. Do not connect to any other signal or supply.
(1) I = input, O = output
(2) BQB package only