SCES015M JULY   1995  – June 2015 SN74ALVCH16245

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Operating Characteristics
    8. 6.8 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagrams
    3. 8.3 Feature Description
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Community Resources
    2. 12.2 Trademarks
    3. 12.3 Electrostatic Discharge Caution
    4. 12.4 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DGG|48
  • DL|48
  • DGV|48
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)
MIN MAX UNIT
VCC Supply voltage –0.5 4.6 V
VI Input voltage(2)(3) –0.5 VCC + 0.5 V
VO Output voltage(2)(3) –0.5 VCC + 0.5 V
IIK Input clamp current VI < 0 –50 mA
IOK Output clamp current VO < 0 –50 mA
IO Continuous output current ±50 mA
Continuous current through each VCC or GND ±100 mA
Tstg Storage temperature –65 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) The input negative-voltage and output voltage ratings may be exceeded if the input and output current ratings are observed.
(3) This value is limited to 4.6 V maximum.

6.2 ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins(1) 2000 V
Charged-device model (CDM), per JEDEC specification JESD22-C101, all pins(2) 1000
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

See (1).
MIN MAX UNIT
VCC Supply voltage 1.65 3.6 V
VIH High-level input voltage VCC = 1.65 V to 1.95 V 0.65 × VCC V
VCC = 2.3 V to 2.7 V 1.7
VCC = 2.7 V to 3.6 V 2
VIL Low-level input voltage VCC = 1.65 V to 1.95 V 0.35 × VCC V
VCC = 2.3 V to 2.7 V 0.7
VCC = 2.7 V to 3.6 V 0.8
VI Input voltage 0 VCC V
VO Output voltage 0 VCC V
IOH High-level output current VCC = 1.65 V –4 mA
VCC = 2.3 V –12
VCC = 2.7 V –12
VCC = 3 V –24
IOL Low-level output current VCC = 1.65 V 4 mA
VCC = 2.3 V 12
VCC = 2.7 V 12
VCC = 3 V 24
Δt/Δv Input transition rise or fall rate 10 ns/V
TA Operating free-air temperature –40 85 °C
(1) All unused control inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs, SCBA004.

6.4 Thermal Information(1)

THERMAL METRIC(1) SN74ALVCH16245 UNIT
DGG
(TSSOP)(2)		 DGV
(TVSOP)(2)		 DL
(SSOP)(2)		 GQL/ZQL (BGA MICROSTAR JUNIOR)(2) GRD/ZRD (BGA MICROSTAR JUNIOR)(2)
48 PINS 48 PINS 48 PINS 56 PINS 54 PINS
RθJA Junction-to-ambient thermal resistance 70 58 63 42 36 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.
(2) The package thermal impedance is calculated in accordance with JESD 51-7.

6.5 Electrical Characteristics

over recommended operating free-air temperature range (unless otherwise noted)
PARAMETER TEST CONDITIONS VCC MIN TYP(1) MAX UNIT
VOH IOH = –100 µA 1.65 V to 3.6 V VCC – 0.2 V
IOH = –4 mA 1.65 V 1.2
IOH = –6 mA 2.3 V 2
IOH = –12 mA 2.3 V 1.7
2.7 V 2.2
3 V 2.4
IOH = –24 mA 3 V 2
VOL IOL = 100 µA 1.65 V to 3.6 V 0.2 V
IOL = 4 mA 1.65 V 0.45
IOL = 6 mA 2.3 V 0.4
IOL = 12 mA 2.3 V 0.7
2.7 V 0.4
IOL = 24 mA 3 V 0.55
II VI = VCC or GND 3.6 V ±5 µA
II(hold) VI = 0.58 V 1.65 V 25 µA
VI = 1.07 V 1.65 V –25
VI = 0.7 V 2.3 V 45
VI = 1.7 V 2.3 V –45
VI = 0.8 V 3 V 75
VI = 2 V 3 V –75
VI = 0 to 3.6 V(2) 3.6 V ±500
IOZ(3) VO = VCC or GND 3.6 V ±10 µA
ICC VI = VCC or GND, IO = 0 3.6 V 40 µA
ΔICC One input at VCC  – 0.6 V, Other inputs at VCC or GND 3 V to 3.6 V 750 µA
Ci Control inputs VI = VCC or GND 3.3 V 4 pF
Cio A or B ports VO = VCC or GND 3.3 V 8 pF
(1) All typical values are at VCC = 3.3 V, TA = 25°C.
(2) This is the bus-hold maximum dynamic current. It is the minimum overdrive current required to switch the input from one state to another.
(3) For I/O ports, the parameter IOZ includes the input leakage current.

6.6 Switching Characteristics

over recommended operating free-air temperature range (unless otherwise noted) (see Figure 7)
PARAMETER FROM
(INPUT)		 TO
(OUTPUT)		 VCC = 1.8 V VCC = 2.5 V
± 0.2 V 		VCC = 2.7 V VCC = 3.3 V
± 0.3 V		 UNIT
TYP  MIN MAX MIN MAX MIN MAX
tpd A or B B or A See(1)  1 3.7 3.6 1 3 ns
ten OE A or B See(1)  1 5.7 5.4 1 4.4 ns
tdis OE A or B See(1)  1 5.2 4.6 1 4.1 ns
(1) This information was not available at the time of publication.

6.7 Operating Characteristics

TA = 25°C
PARAMETER TEST CONDITIONS VCC = 1.8 V VCC = 2.5 V VCC = 3.3 V UNIT
TYP  TYP TYP
Cpd Power dissipation
capacitance		 Outputs enabled CL = 50 pF, f = 10 MHz See(1)  22 29 pF
Outputs disabled See(1)  4 5
(1) This information was not available at the time of publication.

6.8 Typical Characteristics

SN74ALVCH16245 tpvstemp_1.gifFigure 1. Propagation Delay Time vs Operating Free-Air Temperature
SN74ALVCH16245 tpvsoutputs_1.gifFigure 3. Propagation Delay Time vs Number of Outputs Switching
SN74ALVCH16245 tpvsload_1.gifFigure 5. Propagation Delay Time vs Load Capacitancc
SN74ALVCH16245 tpvstemp_2.gifFigure 2. Propagation Delay Time vs Operating Free-Air Temperature
SN74ALVCH16245 tpvsoutputs_2.gifFigure 4. Propagation Delay Time vs Number of Outputs Switching
SN74ALVCH16245 tpvsload_2.gifFigure 6. Propagation Delay Time vs Load Capacitance