SCES590E JULY   2004  – March 2018 SN74AUP1G06

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Logic Diagram
  4. 4 Revision History
  5. 5 Pin Functions and Configurations
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics
    6. 6.6  Switching Characteristics, CL = 5 pF
    7. 6.7  Switching Characteristics, CL = 10 pF
    8. 6.8  Switching Characteristics, CL = 15 pF
    9. 6.9  Switching Characteristics
    10. 6.10 Operating Characteristics
    11. 6.11 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 CMOS Open-Drain Outputs
      2. 8.3.2 Standard CMOS Inputs
      3. 8.3.3 Clamp Diodes
      4. 8.3.4 Partial Power Down (Ioff)
      5. 8.3.5 Over-voltage Tolerant Inputs
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Community Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DPW|5
  • DBV|5
  • DSF|6
  • DCK|5
  • DRL|5
  • DRY|6
  • YFP|4
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.4 Thermal Information

THERMAL METRIC(1) SN74AUP1G06 UNIT
DBV
(SOT-23)		 DCK
(SC70)		 DRL
(SOT-5X3)		 DRY
(SON)		 DPW
(X2SON)		 DSF
(SON)		 YFP
(DSBGA)
5 PINS 5 PINS 5 PINS 6 PINS 5 PINS 6 PINS 4 PINS
RθJA Junction-to-ambient thermal resistance 230.5 303.6 295.1 342.1 504.3 377.1 179.3 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 172.7 203.8 131.0 233.1 234.9 187.7 2.8 °C/W
RθJB Junction-to-board thermal resistance 62.2 100.9 143.9 206.7 370.3 236.6 58.3 °C/W
ψJT Junction-to-top characterization parameter 49.3 76.1 14.7 63.4 44.5 29.0 1.1 °C/W
ψJB Junction-to-board characterization parameter 61.6 99.3 144.4 206.7 369.7 236.3 58.6 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance N/A N/A N/A N/A 165.2 N/A N/A °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.