SCES502Q November 2003 – March 2024 SN74AUP1G08
PRODUCTION DATA
Refer to the PDF data sheet for device specific package drawings
THERMAL METRIC(1) | SN74AUP1G08 | UNIT | ||||||
---|---|---|---|---|---|---|---|---|
DBV (SOT-23) | DCK (SC70) | DRL (SOT) | DSF (SON) | DRY (SON) | DPW (X2SON) | |||
5 PINS | 5 PINS | 5 PINS | 6 PINS | 6 PINS | 5 PINS | |||
RθJA | Junction-to-ambient thermal resistance | 298.6 | 314.4 | 349.7 | 407.1 | 554.9 | 291.8 | °C/W |
RθJC(top) | Junction-to-case (top) thermal resistance | 240.2 | 128.7 | 120.5 | 232 | 385.4 | 224.2 | °C/W |
RθJB | Junction-to-board thermal resistance | 134.6 | 100.6 | 171.4 | 306.9 | 388.2 | 245.8 | °C/W |
ψJT | Junction-to-top characterization parameter | 114.5 | 7.1 | 10.8 | 40.3 | 159 | 245.6 | °C/W |
ψJB | Junction-to-board characterization parameter | 133.9 | 99.8 | 169.4 | 306 | 384.1 | 195.4 | °C/W |