SCES578J June   2003  – September 2017 SN74AUP1G14

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics
    6. 6.6  Switching Characteristics: CL = 5 pF
    7. 6.7  Switching Characteristics: CL = 10 pF
    8. 6.8  Switching Characteristics: CL = 15 pF
    9. 6.9  Switching Characteristics: CL = 30 pF
    10. 6.10 Operating Characteristics
    11. 6.11 Typical Characteristics
  7. Parameter Measurement Information
    1. 7.1 (Propagation Delays, Setup and Hold Times, and Pulse Width)
    2. 7.2 (Enable and Disable Times)
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagrams
    3. 8.3 Feature Description
      1. 8.3.1 Balanced CMOS Push-Pull Outputs
      2. 8.3.2 Schmitt-Trigger Inputs
      3. 8.3.3 Clamp Diodes
      4. 8.3.4 Partial Power Down (Ioff)
      5. 8.3.5 Over-Voltage Tolerant Inputs
    4. 8.4 Device Functional Modes
  9. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Community Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Specifications

Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)
MIN MAX UNIT
VCC Supply voltage –0.5 4.6 V
VI Input voltage(2) –0.5 4.6 V
VO Voltage range applied to any output in the high-impedance or power-off state(2) –0.5 4.6 V
VO Voltage range applied to any output in the high or low state(2) –0.5 VCC + 0.5 V
IIK Input clamp current VI < 0 –50 mA
IOK Output clamp current VO < 0 –50 mA
IO Continuous output current ±20 mA
Continuous current through VCC or GND ±50 mA
TJ Junction temperature 150 °C
Tstg Storage temperature –65 150 °C
Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
The input and output negative-voltage ratings may be exceeded if the input and output current ratings are observed.

ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) 2000 V
Charged-device model (CDM), per JEDEC specification JESD22-C101(2) 1000
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

Recommended Operating Conditions

See(1)
MIN MAX UNIT
VCC Supply voltage 0.8 3.6 V
VI Input voltage 0 3.6 V
VO Output voltage 0 VCC V
IOH High-level output current VCC = 0.8 V –20 µA
VCC = 1.1 V –1.1 mA
VCC = 1.4 V –1.7
VCC = 1.65 V –1.9
VCC = 2.3 V –3.1
VCC = 3 V –4
IOL Low-level output current VCC = 0.8 V 20 µA
VCC = 1.1 V 1.1 mA
VCC = 1.4 V 1.7
VCC = 1.65 V 1.9
VCC = 2.3 V 3.1
VCC = 3 V 4
TA Operating free-air temperature –40 85 °C
All unused inputs of the device must be held at VCC or GND to assure proper device operation. See Implications of Slow or Floating CMOS Inputs.

Thermal Information

THERMAL METRIC(1) SN74AUP1G14 UNIT
DRY
(SON)
DSF
(SON)
YFP
(DSBGA)
DPW
(X2SON)
DBV
(SOT-23)
DCK
(SC70)
DRL
(SOT)
6 PINS 6 PINS 4 PINS 5 PINS 5 PINS 5 PINS 5 PINS
RθJA Junction-to-ambient thermal resistance 347.8 386.2 179.3 489.2 289.1 325.1 324.4 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 237.7 192.9 2.8 226.3 213.7 229.1 156.7 °C/W
RθJB Junction-to-board thermal resistance 210.6 242.2 58.3 352.9 123.0 123.2 172.9 °C/W
ψJT Junction-to-top characterization parameter 64.4 28.9 1.1 38.2 104.5 96.3 21.6 °C/W
ψJB Junction-to-board characterization parameter 210.6 241.9 58.6 352.1 122.3 122.4 173.6 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance N/A N/A N/A 150.8 N/A N/A N/A °C/W
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.

Electrical Characteristics

over operating free-air temperature range (unless otherwise noted)
PARAMETER TEST CONDITIONS VCC MIN TYP MAX UNIT
VT+ Positive-going input threshold voltage TA = 25°C 0.8 V 0.3 0.6 V
TA = –40°C to +85°C
TA = 25°C 1.1 V 0.53 0.9
TA = –40°C to +85°C
TA = 25°C 1.4 V 0.74 1.11
TA = –40°C to +85°C
TA = 25°C 1.65 V 0.91 1.29
TA = –40°C to +85°C
TA = 25°C 2.3 V 1.37 1.77
TA = –40°C to +85°C
TA = 25°C 3 V 1.88 2.29
TA = –40°C to +85°C
VT– Negative-going input threshold voltage TA = 25°C 0.8 V 0.1 0.6 V
TA = –40°C to +85°C
TA = 25°C 1.1 V 0.26 0.65
TA = –40°C to +85°C
TA = 25°C 1.4 V 0.39 0.75
TA = –40°C to +85°C
TA = 25°C 1.65 V 0.47 0.84
TA = –40°C to +85°C
TA = 25°C 2.3 V 0.69 1.04
TA = –40°C to +85°C
TA = 25°C 3 V 0.88 1.24
TA = –40°C to +85°C
ΔVT Hysteresis
(VT+ – VT– )
TA = 25°C 0.8 V 0.07 0.5 V
TA = –40°C to +85°C
TA = 25°C 1.1 V 0.08 0.46
TA = –40°C to +85°C
TA = 25°C 1.4 V 0.18 0.56
TA = –40°C to +85°C
TA = 25°C 1.65 V 0.27 0.66
TA = –40°C to +85°C
TA = 25°C 2.3 V 0.53 0.92
TA = –40°C to +85°C
TA = 25°C 3 V 0.79 1.31
TA = –40°C to +85°C
VOH IOH = –20 µA TA = 25°C 0.8 V to 3.6 V VCC  – 0.1 V
TA = –40°C to +85°C
IOH = –1.1 mA TA = 25°C 1.1 V 0.75 × VCC
TA = –40°C to +85°C 0.7 × VCC
IOH = –1.7 mA TA = 25°C 1.4 V 1.11
TA = –40°C to +85°C 1.03
IOH = –1.9 mA TA = 25°C 1.65 V 1.32
TA = –40°C to +85°C 1.3
IOH = –2.3 mA TA = 25°C 2.3 V 2.05
TA = –40°C to +85°C 1.97
IOH = –3.1 mA TA = 25°C 1.9
TA = –40°C to +85°C 1.85
IOH = –2.7 mA TA = 25°C 3 V 2.72
TA = –40°C to +85°C 2.67
IOH = –4 mA TA = 25°C 2.6
TA = –40°C to +85°C 2.55
VOL IOL = 20 μA TA = 25°C 0.8 V to 3.6 V 0.1 V
TA = –40°C to +85°C
IOL = 1.1 mA TA = 25°C 1.1 V 0.3 × VCC
TA = –40°C to +85°C
IOL = 1.7 mA TA = 25°C 1.4 V 0.31
TA = –40°C to +85°C 0.37
IOL = 1.9 mA TA = 25°C 1.65 V 0.31
TA = –40°C to +85°C 0.35
IOL = 2.3 mA TA = 25°C 2.3 V 0.31
TA = –40°C to +85°C 0.33
IOL = 3.1 mA TA = 25°C 0.44
TA = –40°C to +85°C 0.45
IOL = 2.7 mA TA = 25°C 3 V 0.31
TA = –40°C to +85°C 0.33
IOL = 4 mA TA = 25°C 0.44
TA = –40°C to +85°C 0.45
II A input VI = GND to 3.6 V TA = 25°C 0 V to 3.6 V 0.1 µA
TA = –40°C to +85°C 0.5
IOFF VI or
VO = 0 V to 3.6 V
TA = 25°C 0 V 0.2 µA
TA = –40°C to +85°C 0.6
ΔI OFF VI or
VO = 0 V to 3.6 V
TA = 25°C 0 V to 0.2 V 0.2
TA = –40°C to +85°C 0.6
ICC VI = GND or (VCC to 3.6 V)
IO = 0
TA = 25°C 0.8 V to 3.6 V 0.5 µA
TA = –40°C to +85°C 0.9
ΔICC VI = VCC – 0.6 V
IO = 0
TA = 25°C 3.3 V 40 µA
TA = –40°C to +85°C 50
CI VI = VCC or GND TA = –40°C to +85°C 0 V 1.5 pF
TA = –40°C to +85°C 3.6 V
CO VO = GND TA = –40°C to +85°C 0 V 2.5 pF

Switching Characteristics: CL = 5 pF

over recommended operating free-air temperature range, CL = 5 pF (unless otherwise noted) (see Figure 2 and Figure 3)
PARAMETER FROM
(INPUT)
TO
(OUTPUT)
TEST CONDITIONS MIN TYP MAX UNIT
tpd A Y VCC = 0.8 V TA = 25°C 16.3 ns
VCC = 1.2 V ± 0.1 V TA = 25°C 4.2 6.9 11.7
TA = –40°C to +85°C 0.9 15
VCC = 1.5 V ± 0.1 V TA = 25°C 3.7 5.2 8.4
TA = –40°C to +85°C 1.7 10.7
VCC = 1.8 V ± 0.15 V TA = 25°C 3.3 4.4 6.9
TA = –40°C to +85°C 1.9 8.5
VCC = 2.5 V ± 0.2 V TA = 25°C 2.8 3.5 4.8
TA = –40°C to +85°C 1.8 6.1
VCC = 3.3 V ± 0.3 V TA = 25°C 2.5 3 4
TA = –40°C to +85°C 1.7 4.9

Switching Characteristics: CL = 10 pF

over recommended operating free-air temperature range, CL = 10 pF (unless otherwise noted) (see Figure 2 and Figure 3)
PARAMETER FROM
(INPUT)
TO
(OUTPUT)
TEST CONDITIONS MIN TYP MAX UNIT
tpd A Y VCC = 0.8 V TA = 25°C 18.4 ns
VCC = 1.2 V ± 0.1 V TA = 25°C 4.6 7.9 13.4
TA = –40°C to +85°C 1.3 16.7
VCC = 1.5 V ± 0.1 V TA = 25°C 4 6 9.6
TA = –40°C to +85°C 2.2 11.8
VCC = 1.8 V ± 0.15 V TA = 25°C 3.6 5 7.9
TA = –40°C to +85°C 2.4 9.5
VCC = 2.5 V ± 0.2 V TA = 25°C 3.2 4 5.5
TA = –40°C to +85°C 2.3 6.8
VCC = 3.3 V ± 0.3 V TA = 25°C 2.9 3.5 4.6
TA = –40°C to +85°C 2.1 5.6

Switching Characteristics: CL = 15 pF

over recommended operating free-air temperature range, CL = 15 pF (unless otherwise noted) (see Figure 2 and Figure 3)
PARAMETER FROM
(INPUT)
TO
(OUTPUT)
TEST CONDITIONS MIN TYP MAX UNIT
tpd A Y VCC = 0.8 V TA = 25°C 20.1 ns
VCC = 1.2 V ± 0.1 V TA = 25°C 5.5 8.7 14
TA = –40°C to +85°C 2.5 17.3
VCC = 1.5 V ± 0.1 V TA = 25°C 4.7 6.7 10
TA = –40°C to +85°C 3 12.5
VCC = 1.8 V ± 0.15 V TA = 25°C 4.2 5.6 8.3
TA = –40°C to +85°C 3 10.1
VCC = 2.5 V ± 0.2 V TA = 25°C 3.6 4.5 5.9
TA = –40°C to +85°C 2.7 7.4
VCC = 3.3 V ± 0.3 V TA = 25°C 3.3 3.9 5
TA = –40°C to +85°C 2.5 6.1

Switching Characteristics: CL = 30 pF

over recommended operating free-air temperature range, CL = 30 pF (unless otherwise noted) (see Figure 2 and Figure 3)
PARAMETER FROM
(INPUT)
TO
(OUTPUT)
TEST CONDITIONS MIN TYP MAX UNIT
tpd A Y VCC = 0.8 V TA = 25°C 25.7 ns
VCC = 1.2 V ± 0.1 V TA = 25°C 7.4 11.2 17.1
TA = –40°C to +85°C 4.5 20.5
VCC = 1.5 V ± 0.1 V TA = 25°C 6.1 8.5 12.3
TA = –40°C to +85°C 4.6 14.7
VCC = 1.8 V ± 0.15 V TA = 25°C 5.4 7.2 10.3
TA = –40°C to +85°C 4.1 12
VCC = 2.5 V ± 0.2 V TA = 25°C 4.7 5.7 7.4
TA = –40°C to +85°C 3.7 8.8
VCC = 3.3 V ± 0.3 V TA = 25°C 4.2 5 6.2
TA = –40°C to +85°C 3.5 7.3

Operating Characteristics

TA = 25°C
PARAMETER TEST CONDITIONS VCC TYP UNIT
Cpd Power dissipation capacitance f = 10 MHz 0.8 V 4 pF
1.2 V ± 0.1 V 4
1.5 V ± 0.1 V 4.1
1.8 V ± 0.15 V 4.1
2.5 V ± 0.2 V 4.3
3.3 V ± 0.3 V 4.4

Typical Characteristics

SN74AUP1G14 tpd_curve.gif Figure 1. Typical Propagation Delay vs. Supply Voltage (CL = 15 pF