SCES592I July   2004  – September 2017 SN74AUP1G79

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics: TA = 25°C
    6. 6.6  Electrical Characteristics: TA = -40°C to 85°C
    7. 6.7  Timing Requirements
    8. 6.8  Switching Characteristics: CL = 5 pF
    9. 6.9  Switching Characteristics: CL = 10 pF
    10. 6.10 Switching Characteristics: CL = 15 pF
    11. 6.11 Switching Characteristics: CL = 30 pF
    12. 6.12 Operating Characteristics
    13. 6.13 Typical Characteristics
  7. 7 Parameter Measurement Information
    1. 7.1 Propagation Delays, Setup and Hold Times, and Pulse Width
    2. 7.2 Enable and Disable Times
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Balanced CMOS Push-Pull Outputs
      2. 8.3.2 Standard CMOS Inputs
      3. 8.3.3 Clamp Diodes
      4. 8.3.4 Partial Power Down (Ioff)
      5. 8.3.5 Over-voltage Tolerant Inputs
    4. 8.4 Device Functional Modes
  9. 9 Applications, Implementation, and Layout
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Community Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)
MIN MAX UNIT
VCC Supply voltage –0.5 4.6 V
VI Input voltage(2) –0.5 4.6 V
VO Voltage range applied to any output in the high-impedance or power-off state(2) –0.5 4.6 V
VO Output voltage range in the high or low state(2) –0.5 VCC + 0.5 V
IIK Input clamp current VI < 0 –50 mA
IOK Output clamp current VO < 0 –50 mA
IO Continuous output current ±20 mA
Continuous current through VCC or GND ±50 mA
TJ Maximum junction temperature 150 °C
Tstg Storage temperature –65 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) The input negative-voltage and output voltage ratings may be exceeded if the input and output current ratings are observed.

6.2 ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) 2000 V
Charged-device model (CDM), per JEDEC specification JESD22-C101(2) 1000
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

MIN MAX UNIT
VCC Supply voltage 0.8 3.6 V
VIH High-level input voltage VCC = 0.8 V VCC V
VCC = 1.1 V to 1.95 V 0.65 × VCC
VCC = 2.3 V to 2.7 V 1.6
VCC = 3 V to 3.6 V 2
VIL Low-level input voltage VCC = 0.8 V 0 V
VCC = 1.1 V to 1.95 V 0.35 × VCC
VCC = 2.3 V to 2.7 V 0.7
VCC = 3 V to 3.6 V 0.9
VI Input voltage(1) 0 3.6 V
VO Output voltage 0 VCC V
IOH High-level output current VCC = 0.8 V –20 µA
VCC = 1.1 V –1.1 mA
VCC = 1.4 V –1.7
VCC = 1.65 V –1.9
VCC = 2.3 V –3.1
VCC = 3 V –4
IOL Low-level output current VCC = 0.8 V 20 µA
VCC = 1.1 V 1.1 mA
VCC = 1.4 V 1.7
VCC = 1.65 V 1.9
VCC = 2.3 V 3.1
VCC = 3 V 4
Δt/Δv Input transition rise or fall rate VCC = 0.8 V to 3.6 V 200 ns/V
TA Operating free-air temperature –40 85 °C
(1) All unused inputs of the device must be held at VCC or GND to assure proper device operation. See the TI application report, Implications of Slow or Floating CMOS Inputs.

6.4 Thermal Information

THERMAL METRIC(1) SN74AUP1G79 UNIT
DBV
(SOT-23)		 DCK
(SC70)		 DRL
(SOT-5X3)		 DRY
(SON)		 DSF
(SON)		 DPW
(X2SON)		 YFP
(DSBGA)		 YZP
(DSBGA)
5 PINS 5 PINS 5 PINS 6 PINS 6 PINS 5 PINS 6 PINS 5 PINS
RθJA Junction-to-ambient thermal resistance 267.2 284.1 294.1 341.1 377.1 489.2 125.4 146.2 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 191.9 208.5 132.5 233.1 187.7 226.3 1.9 1.4 °C/W
RθJB Junction-to-board thermal resistance 101.1 103.1 143.4 206.7 236.6 352.9 37.2 39.3 °C/W
ψJT Junction-to-top characterization parameter 83.0 76.6 14.5 63.4 29.0 38.2 0.5 0.7 °C/W
ψJB Junction-to-board characterization parameter 100.8 102.3 143.9 206.7 236.3 352.1 37.5 39.8 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance N/A N/A N/A N/A N/A 150.8 N/A N/A °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.

6.5 Electrical Characteristics: TA = 25°C

over recommended operating free-air temperature range (unless otherwise noted)
PARAMETER TEST CONDITIONS VCC MIN TYP MAX UNIT
VOH IOH = –20 µA 0.8 V to 3.6 V VCC – 0.1 V
IOH = –1.1 mA 1.1 V 0.75 × VCC
IOH = –1.7 mA 1.4 V 1.11
IOH = –1.9 mA 1.65 V 1.32
IOH = –2.3 mA 2.3 V 2.05
IOH = –3.1 mA 1.9
IOH = –2.7 mA 3 V 2.72
IOH = –4 mA 2.6
VOL IOL = 20 µA 0.8 V to 3.6 V 0.1 V
IOL = 1.1 mA 1.1 V 0.3 ×  VCC
IOL = 1.7 mA 1.4 V 0.31
IOL = 1.9 mA 1.65 V 0.31
IOL = 2.3 mA 2.3 V 0.31
IOL = 3.1 mA 0.44
IOL = 2.7 mA 3 V 0.31
IOL = 4 mA 0.44
II D or CLK
input		 VI = GND to 3.6 V 0 V to 3.6 V 0.1 µA
Ioff VI or VO = 0 V to 3.6 V 0 V 0.2 µA
ΔIoff VI or VO = 0 V to 3.6 V 0 V to 0.2 V 0.2 µA
ICC VI = GND or VCC to 3.6 V, IO = 0 0.8 V to 3.6 V 0.5 µA
ΔICC VI = VCC – 0.6 V,(1) IO = 0 3.3 V 40 µA
Ci VI = VCC or GND 0 V 1.5 pF
3.6 V 1.5
Co VO = GND 0 V 3 pF
(1) One-input switching

6.6 Electrical Characteristics: TA = –40°C to 85°C

over recommended operating free-air temperature range (unless otherwise noted)
PARAMETER TEST CONDITIONS VCC MIN MAX UNIT
VOH IOH = –20 µA 0.8 V to 3.6 V VCC – 0.1 V
IOH = –1.1 mA 1.1 V 0.7 × VCC
IOH = –1.7 mA 1.4 V 1.03
IOH = –1.9 mA 1.65 V 1.3
IOH = –2.3 mA 2.3 V 1.97
IOH = –3.1 mA 1.85
IOH = –2.7 mA 3 V 2.67
IOH = –4 mA 2.55
VOL IOL = 20 µA 0.8 V to 3.6 V 0.1 V
IOL = 1.1 mA 1.1 V 0.3 ×  VCC
IOL = 1.7 mA 1.4 V 0.37
IOL = 1.9 mA 1.65 V 0.35
IOL = 2.3 mA 2.3 V 0.33
IOL = 3.1 mA 0.45
IOL = 2.7 mA 3 V 0.33
IOL = 4 mA 0.45
II D or CLK
input		 VI = GND to 3.6 V 0 V to 3.6 V 0.5 µA
Ioff VI or VO = 0 V to 3.6 V 0 V 0.6 µA
ΔIoff VI or VO = 0 V to 3.6 V 0 V to 0.2 V 0.6 µA
ICC VI = GND or VCC to 3.6 V, IO = 0 0.8 V to 3.6 V 0.9 µA
ΔICC VI = VCC – 0.6 V,(1) IO = 0 3.3 V 50 µA
(1) One-input switching

6.7 Timing Requirements

over recommended operating free-air temperature range, TA = –40°C to +85°C (unless otherwise noted) (see Figure 3)
VCC MIN TYP(1) MAX UNIT
fclock Clock frequency 0.8 V 20 MHz
1.2 V ± 0.1 V 80
1.5 V ± 0.1 V 100
1.8 V ± 0.15 V 140
2.5 V ± 0.2 V 210
3.3 V ± 0.3 V 260
tw Pulse duration, CLK high or low 0.8 V 4.8 ns
1.2 V ± 0.1 V 2.2
1.5 V ± 0.1 V 1.5
1.8 V ± 0.15 V 1.6
2.5 V ± 0.2 V 1.7
3.3 V ± 0.3 V 1.9
tsu Setup time before CLK↑ Data high 0.8 V 4.2 2.9 ns
1.2 V ± 0.1 V 1.4
1.5 V ± 0.1 V 1
1.8 V ± 0.15 V 0.9
2.5 V ± 0.2 V 0.7
3.3 V ± 0.3 V 0.6
Data low 0.8 V 5.3 3.5
1.2 V ± 0.1 V 1.8
1.5 V ± 0.1 V 1.2
1.8 V ± 0.15 V 1.1
2.5 V ± 0.2 V 1
3.3 V ± 0.3 V 1
th Hold time, data after CLK↑ 0.8 V 0 0 ns
1.2 V ± 0.1 V 0
1.5 V ± 0.1 V 0
1.8 V ± 0.15 V 0
2.5 V ± 0.2 V 0
3.3 V ± 0.3 V 0
(1) TA = 25°C

6.8 Switching Characteristics: CL = 5 pF

over recommended operating free-air temperature range, CL = 5 pF (unless otherwise noted) (see Figure 3 and Figure 4)
PARAMETER FROM
(INPUT)		 TO
(OUTPUT)		 TEST CONDITIONS MIN TYP MAX UNIT
fmax VCC = 0.8 V TA = 25°C 93 MHz
TA = –40°C to +85°C 90
VCC = 1.2 V ± 0.1 V TA = 25°C 199
TA = –40°C to +85°C 220
VCC = 1.5 V ± 0.1 V TA = 25°C 250
TA = –40°C to +85°C 230
VCC = 1.8 V ± 0.15 V TA = 25°C 271
TA = –40°C to +85°C 240
VCC = 2.5 V ± 0.2 V TA = 25°C 280
TA = –40°C to +85°C 250
VCC = 3.3 V ± 0.3 V TA = 25°C 280
TA = –40°C to +85°C 260
tpd CLK Q VCC = 0.8 V TA = 25°C 15.9 ns
VCC = 1.2 V ± 0.1 V TA = 25°C 3.7 6.9 11
TA = –40°C to +85°C 2.6 13.1
VCC = 1.5 V ± 0.1 V TA = 25°C 3 4.8 7.6
TA = –40°C to +85°C 2 8.8
VCC = 1.8 V ± 0.15 V TA = 25°C 2.4 3.8 6.1
TA = –40°C to +85°C 1.5 7.1
VCC = 2.5 V ± 0.2 V TA = 25°C 1.8 2.7 4.4
TA = –40°C to +85°C 1.1 5
VCC = 3.3 V ± 0.3 V TA = 25°C 1.5 2.1 3.6
TA = –40°C to +85°C 0.9 4

6.9 Switching Characteristics: CL = 10 pF

over recommended operating free-air temperature range, CL = 10 pF (unless otherwise noted) (see Figure 3 and Figure 4)
PARAMETER FROM
(INPUT)		 TO
(OUTPUT)		 TEST CONDITIONS MIN TYP MAX UNIT
fmax VCC = 0.8 V TA = 25°C 62 MHz
TA = –40°C to +85°C 50
VCC = 1.2 V ± 0.1 V TA = 25°C 147
TA = –40°C to +85°C 160
VCC = 1.5 V ± 0.1 V TA = 25°C 189
TA = –40°C to +85°C 200
VCC = 1.8 V ± 0.15 V TA = 25°C 180
TA = –40°C to +85°C 240
VCC = 2.5 V ± 0.2 V TA = 25°C 260
TA = –40°C to +85°C 250
VCC = 3.3 V ± 0.3 V TA = 25°C 280
TA = –40°C to +85°C 260
tpd CLK Q VCC = 0.8 V TA = 25°C 18 ns
VCC = 1.2 V ± 0.1 V TA = 25°C 4.3 7.8 12.3
TA = –40°C to +85°C 3.2 14.4
VCC = 1.5 V ± 0.1 V TA = 25°C 3.5 5.5 8.4
TA = –40°C to +85°C 2.5 9.8
VCC = 1.8 V ± 0.15 V TA = 25°C 2.8 4.4 6.8
TA = –40°C to +85°C 1.9 8
VCC = 2.5 V ± 0.2 V TA = 25°C 2.2 3.2 5
TA = –40°C to +85°C 1.5 5.7
VCC = 3.3 V ± 0.3 V TA = 25°C 1.8 2.6 4.1
TA = –40°C to +85°C 1.3 4.5

6.10 Switching Characteristics: CL = 15 pF

over recommended operating free-air temperature range, CL = 15 pF (unless otherwise noted) (see Figure 3 and Figure 4)
PARAMETER FROM
(INPUT)		 TO
(OUTPUT)		 TEST CONDITIONS MIN TYP MAX UNIT
fmax VCC = 0.8 V TA = 25°C 48 MHz
TA = –40°C to +85°C 30
VCC = 1.2 V ± 0.1 V TA = 25°C 112
TA = –40°C to +85°C 120
VCC = 1.5 V ± 0.1 V TA = 25°C 151
TA = –40°C to +85°C 160
VCC = 1.8 V ± 0.15 V TA = 25°C 194
TA = –40°C to +85°C 220
VCC = 2.5 V ± 0.2 V TA = 25°C 248
TA = –40°C to +85°C 250
VCC = 3.3 V ± 0.3 V TA = 25°C 280
TA = –40°C to +85°C 260
tpd CLK Q VCC = 0.8 V TA = 25°C 20.3 ns
VCC = 1.2 V ± 0.1 V TA = 25°C 5 8.7 13.6
TA = –40°C to +85°C 3.9 15.6
VCC = 1.5 V ± 0.1 V TA = 25°C 4.1 6.3 9.3
TA = –40°C to +85°C 3.1 10.7
VCC = 1.8 V ± 0.15 V TA = 25°C 3.3 4 7.6
TA = –40°C to +85°C 2.4 8.7
VCC = 2.5 V ± 0.2 V TA = 25°C 2.6 3.6 5.5
TA = –40°C to +85°C 1.9 6.3
VCC = 3.3 V ± 0.3 V TA = 25°C 2.2 3 4.5
TA = –40°C to +85°C 1.6 5

6.11 Switching Characteristics: CL = 30 pF

over recommended operating free-air temperature range, CL = 30 pF (unless otherwise noted) (see Figure 3 and Figure 4)
PARAMETER FROM
(INPUT)		 TO
(OUTPUT)		 TEST CONDITIONS MIN TYP MAX UNIT
fmax VCC = 0.8 V TA = 25°C 24 MHz
TA = –40°C to +85°C 20
VCC = 1.2 V ± 0.1 V TA = 25°C 72
TA = –40°C to +85°C 80
VCC = 1.5 V ± 0.1 V TA = 25°C 100
TA = –40°C to +85°C 100
VCC = 1.8 V ± 0.15 V TA = 25°C 127
TA = –40°C to +85°C 140
VCC = 2.5 V ± 0.2 V TA = 25°C 185
TA = –40°C to +85°C 210
VCC = 3.3 V ± 0.3 V TA = 25°C 266
TA = –40°C to +85°C 260
tpd CLK Q VCC = 0.8 V TA = 25°C 27.2 ns
VCC = 1.2 V ± 0.1 V TA = 25°C 7 11.5 17.3
TA = –40°C to +85°C 5.9 24
VCC = 1.5 V ± 0.1 V TA = 25°C 5.7 8.3 11.8
TA = –40°C to +85°C 4.6 15.9
VCC = 1.8 V ± 0.15 V TA = 25°C 4.7 6.7 9.6
TA = –40°C to +85°C 3.8 13
VCC = 2.5 V ± 0.2 V TA = 25°C 3.7 4.9 7
TA = –40°C to +85°C 2.9 9
VCC = 3.3 V ± 0.3 V TA = 25°C 3.2 4.1 5.8
TA = –40°C to +85°C 2.6 7.2

6.12 Operating Characteristics

TA = 25°C
PARAMETER TEST CONDITIONS VCC TYP UNIT
Cpd Power dissipation capacitance f = 10 MHz 0.8 V 2.5 pF
1.2 V ± 0.1 V 2.5
1.5 V ± 0.1 V 2.5
1.8 V ± 0.15 V 2.5
2.5 V ± 0.2 V 3
3.3 V ± 0.3 V 3

6.13 Typical Characteristics

SN74AUP1G79 D001_SCES604.gif Figure 1. TPD vs VCC
SN74AUP1G79 D002_SCES604.gif Figure 2. TPD vs Temperature