SCES748E September   2009  – October 2021 SN74AUP2G07

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics
    6. 6.6  Switching Characteristics, CL = 5 pF
    7. 6.7  Switching Characteristics, CL = 10 pF
    8. 6.8  Switching Characteristics, CL = 15 pF
    9. 6.9  Switching Characteristics, CL = 30 pF
    10. 6.10 Operating Characteristics
    11. 6.11 Typical Characteristics
  7. 7 Parameter Measurement Information
    1. 7.1 Propagation Delays, Setup and Hold Times, and Pulse Duration
    2. 7.2 Enable and Disable Times
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Receiving Notification of Documentation Updates
    2. 12.2 Support Resources
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from Revision D (February 2016) to Revision E (October 2021)

  • Changed pinout images style and formatting, removed overlapping letters in YZP package drawing, corrected BGA pin numbers in the Pin Functions table, changed VCC and GND pin TYPE From: "—" To: "P" in the Pin Functions table and added footnote to the Pin Functions table to define pin typesGo
  • Changed maximum output voltage in the low state in the Section 6.1 table to 4.6 VGo
  • Changed the VO Output voltage in the Section 6.3 table from 'VCC' to '3.6'Go
  • Updated RθJA values to more accurately reflect device characteristics: YFP 132 to 125.4, DCK 252 to 302.4, DRY 234 to 338, DSF 300 to 372.5, added standard thermal characteristics for all packages (RθJC(top), RθJB, ΨJT, ΨJB, RθJC(bot))Go

Changes from Revision C (November 2014) to Revision D (February 2016)

  • Changed the VCC pin TYPE From: "I" To: "—" in the Pin Functions tableGo
  • Added "Junction temperature" to the Section 6.1 table Go
  • Deleted the IOH High-level output current from the Section 6.3 table Go
  • Deleted VOH PARAMETER from the Section 6.5 table, these specifications do not pertain to open drain devicesGo

Changes from Revision B (September 2009) to Revision C (November 2014)

  • Removed Ordering Information table.Go
  • Added Applications, Device Information table, Pin Functions table, Handling Ratings table, Thermal Information table, Typical Characteristics, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section.Go
  • Updated Ioff in Features. Go